Telecom DS3170N+ product image

DS3170N+

  • Description:IC TELECOM INTERFACE 100CSBGA
  • Series:-

SKU:c7b45a30b09c Category: Brand:

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DS3170N+ is listed in the Telecom range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC TELECOM INTERFACE 100CSBGA. Review the specifications below when checking this part for your BOM.

Telecom specifications for DS3170N+

  • Description:IC TELECOM INTERFACE 100CSBGA
  • Series:-
  • Mfr:Analog Devices Inc./Maxim Integrated
  • Package:Tray
  • Function:Single-Chip Transceiver
  • Interface:DS3, E3
  • Number of Circuits:1
  • Voltage - Supply:3.135V ~ 3.465V
  • Current - Supply:120mA
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA, CSBGA
  • Supplier Device Package:100-CSBGA (11x11)
  • Power (Watts):-
  • Grade:-
  • Qualification:-

Telecom datasheet and documents for DS3170N+

DS3170N+

Telecom Overview

The DS3170N+ is a single-chip transceiver designed for DS3 and E3 physical copper line interfaces. It integrates a DS3/E3 framer, a Line Interface Unit (LIU), and a jitter attenuator. The device supports receive clock/data recovery and transmit waveshaping. It features an on-chip BERT, HDLC controller with a 256-byte FIFO, and performance-monitoring counters. The component operates at 3.3V with 5V tolerant I/O and consumes approximately 0.5W of power. It utilizes a 100-pin CSBGA package measuring 11mm x 11mm with a 1mm height. The industrial temperature range extends from -40°C to +85°C.

Telecom Feature Summary

  • Integrates a DS3/E3 framer and LIU into a single chip
  • Includes built-in HDLC controller with 256-byte FIFO
  • Features on-chip BERT for pattern generation and detection
  • Supports flexible overhead insertion and extraction

Telecom Applications

  • Access Concentrators
  • Multiservice Access Platforms (MSAPs)
  • SONET/SDH ADM and MSPPs
  • PBXs and Test Equipment

Telecom Procurement Notes

Verify the specific ordering suffix against official documentation to confirm compliance status. The plus sign indicates lead-free and RoHS compliant packaging. Confirm that the industrial temperature grade (-40°C to +85°C) matches the design requirements. Ensure the 100-pin CSBGA footprint aligns with the PCB layout specifications before finalizing procurement.

Telecom Selection Notes

Select this component when a combined framer and transceiver solution is required for DS3 or E3 applications. Verify compatibility with the system's microprocessor interface, supporting both 8-bit and 16-bit parallel modes as well as serial SPI. Check if the integrated jitter attenuator placement options suit the network timing architecture. Confirm that the 3.3V power supply and low-power consumption meet the thermal constraints of the enclosure.

Telecom Part Context

The DS3170N+ belongs to the DS3170 family of single-chip transceivers manufactured by Analog Devices / Maxim Integrated. This series provides comprehensive solutions for digital cross-connect systems and multiplexers. The N suffix specifically denotes the industrial temperature rating, distinguishing it from commercial variants. It serves as a core interface component in telecommunications infrastructure requiring high reliability.

Telecom Replacement Considerations

The datasheet notes software compatibility with the DS3171 through DS3174 SCT product family. These devices may serve as functional alternatives within the same ecosystem. Verify register mapping and pinout compatibility before substituting. Consult the manufacturer's errata for any known deviations between revisions.

DS3170N+DS3170N+

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