DS3177N+T

Overview

The DS3177N+ is a single-chip transceiver for DS3 and E3 physical copper lines, integrating a framer and a Line Interface Unit (LIU). It operates within an industrial temperature range of -40°C to +85°C. The device utilizes a 100-pin CSBGA package measuring 11mm x 11mm with a 1mm height. Power consumption is specified at 0.5W during 3.3V operation, featuring 5V tolerant I/O. The component supports both M23/C-Bit DS3 and G.751/G.832 E3 framing standards.

Feature Summary

• Integrates receive clock/data recovery and transmit waveshaping capabilities for DS3 and E3 protocols.
• Includes an on-chip jitter attenuator that can be positioned in either the receive or transmit signal path.
• Features a built-in HDLC controller equipped with a 256-byte FIFO for overhead insertion and extraction.
• Provides flexible loopback configurations including line, diagnostic, framer, payload, and analog modes.

Applications

• Access Concentrators
• Multiservice Access Platforms (MSAPs)
• SONET/SDH ADMs and MSPPs
• Test Equipment

Procurement Notes

Verify the specific ordering suffix against official documentation to confirm the operational temperature range. The 'N' designation indicates industrial grade (-40°C to +85°C), while other suffixes may denote commercial ranges. Ensure the lead-free/RoHS compliant status matches project requirements before finalizing procurement orders.

Selection Notes

Select this component when a combined framer and LIU solution is required for DS3/E3 applications. Consider the integrated jitter attenuator and BERT features if system-level testing and performance monitoring are necessary without external logic. Verify compatibility with existing microprocessor interfaces, as it supports both parallel and serial SPI connections.

Part Context

This device belongs to the DS317x product family, which includes single, dual, triple, and quad versions of the DS3/E3 single-chip transceiver. It maintains software compatibility with the broader DS3171 through DS3174 SCT product family, facilitating easier upgrades or scaling across different port density requirements within telecommunications infrastructure.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult manufacturer documentation for potential cross-references or updated revisions within the same product family.