DS90C363AMTDX

Overview

The DS90C363AMTDX is a 3.3V programmable LVDS transmitter designed for 18-bit Flat Panel Display (FPD) Link applications, operating at data rates up to 65 MHz. It features three drivers and twenty-one receivers within a single package. The device accepts CMOS or TTL input signals and converts them into low-voltage differential signaling for transmission. It operates on a supply voltage ranging from 3 V to 3.6 V, with a nominal rating of 3.3 V. The component supports an industrial temperature range from -40°C to +85°C and is housed in a 48-pin TSSOP package with a 0.5 mm pitch.

Feature Summary

• Supports 18-bit FPD-Link architecture for flat panel display interfaces
• Integrates multiple LVDS drivers and receivers for signal distribution
• Compatible with standard CMOS and TTL logic input levels

Applications

• Flat panel display link transmitters
• LVDS signal distribution systems
• Industrial display interface circuits

Procurement Notes

Verify the specific suffix 'AMTD' against current Texas Instruments documentation to confirm pinout compatibility and RoHS status. Check for obsolescence notices as National Semiconductor products are often transferred. Ensure the manufacturing source matches the required quality standards for your application.

Selection Notes

Select this component when an 18-bit LVDS transmitter is required for display links. Confirm that the 65 MHz maximum data rate meets system timing requirements. Verify that the 48-pin TSSOP package fits the PCB layout constraints and thermal management needs of the design.

Part Context

This part belongs to the DS90C363 family of LVDS interface ICs originally developed by National Semiconductor and now managed by Texas Instruments. The family includes complementary receiver devices like the DS90CF364. These components are specialized for high-speed video data transmission in display applications.

Replacement Considerations

Direct substitutes include DS90C363MTD/NOPB and DS90C363MTDX/NOPB. Verify functional equivalence and package compatibility before replacement.