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Product Detailed Parameters
- Description：IC REDRIVER LVDS 1CH 8SOIC
- Series：-
- Mfr：Texas Instruments
- Package：Tape & Reel (TR),Cut Tape (CT),Bulk
- Type：Buffer, ReDriver
- Applications：LVDS
- Input：CML, LVDS, LVPECL
- Output：LVDS
- Data Rate (Max)：800Mbps
- Number of Channels：1
- Delay Time：1.4ns
- Signal Conditioning：-
- Voltage - Supply：3V ~ 3.6V
- Current - Supply：47mA
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package：8-SOIC
- Capacitance - Input：-
- Grade：-
- Qualification：-
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Overview
The DS90LV001TMX is an LVDS interface integrated circuit manufactured by Texas Instruments, designed as a high-speed buffer. It features one driver and one receiver with a data rate of 800 Mb/s. The device accepts LVDS or LVPECL input types and provides LVDS output. It operates on a supply voltage ranging from 3 V to 3.6 V, typically at 3.3 V, with a maximum power dissipation of 726 mW. The component supports an operating temperature range from -40°C to +85°C and is housed in an 8-WSON package for surface mount technology.
Feature Summary
- Supports LVDS and LVPECL input signal compatibility
- Provides low differential output swing to reduce electromagnetic interference
- Includes enable pin functionality for controlled signal transmission
Applications
- Buffering LVDS signals in display interfaces
- Signal integrity enhancement in high-speed digital circuits
- Hot-pluggable display system implementations
Procurement Notes
Verify the specific suffix TMX against official datasheets to confirm it denotes the tape-and-reel packaging variant. Ensure the ordering code includes NOPB if lead-free compliance is required. Cross-reference the manufacturer part number with authorized distributors to validate authenticity and current production status before procurement.
Selection Notes
Select this component when a single-channel LVDS buffer is required for data rates up to 800 Mbps. It is suitable for applications needing LVPECL to LVDS translation or signal regeneration. Consider the WSON-8 package constraints and thermal dissipation limits of 726 mW during PCB layout planning.
Part Context
This part belongs to the DS90LV001 series of LVDS buffers. It is functionally related to other devices like the DS90LV004 and DS90LV017, which offer similar buffering capabilities but may differ in channel count or specific electrical characteristics. The TMX suffix specifically indicates the reel packaging format used for automated assembly.
Replacement Considerations
Direct substitutes include the DS90LV001TMX/NOPB for lead-free requirements. Other compatible buffers in the family are the DS90LV004 for multi-channel needs. Verify pinout compatibility and electrical specifications against the original design requirements before substitution.
