DS96175CN

Overview

The DS96175CN is a low-power RS-485/RS-422 differential bus transceiver manufactured by Texas Instruments. It integrates one driver and one receiver, supporting data rates up to 10 Mbps. The device operates from a single 5 V supply with a quiescent current of typically 30 mA. It features fail-safe circuitry to ensure a high logic state when inputs are open. The SN75ALS175 variant offers enhanced performance with lower power consumption and higher noise immunity. The component is housed in a 16-pin DIP package suitable for through-hole mounting.

Feature Summary

• Supports half-duplex communication on RS-485 and RS-422 networks
• Integrated fail-safe mechanism prevents undefined states during idle conditions
• Low-power design reduces thermal dissipation in dense PCB layouts

Applications

• Industrial automation control systems
• Building automation and security networks
• Multi-drop serial communication buses

Procurement Notes

Verify the specific suffix against official documentation to confirm package type and temperature range. Confirm RoHS compliance status as manufacturing processes evolve. Check for obsolescence notices or lifecycle changes before finalizing procurement plans. Ensure ordering codes match the exact functional requirements.

Selection Notes

Select this component for applications requiring reliable half-duplex communication over moderate distances. Compare power consumption metrics against alternative drivers if battery operation is critical. Verify that the 5 V supply voltage aligns with the system's available rails. Consider the 16-pin DIP footprint constraints during mechanical design.

Part Context

This part belongs to the SN75ALS17x family of low-power RS-485/RS-422 transceivers. It serves as a direct replacement for older standard RS-485 drivers while offering improved electrical characteristics. The CN suffix indicates a ceramic dual-in-line package variant designed for robust industrial environments.

Replacement Considerations

The SN75ALS175DR is a pin-compatible surface-mount alternative within the same family. Verify that the transition from DIP to SOIC packaging meets mechanical clearance requirements.