DSA557-0344FI1VAO

DSA557-0344FI1VAO

  • Description:2-OUTPUT AUTOMTIVE GRADE MEMS PC
  • Series:DSA557-03

SKU:071c8ef2891c Category: Brand:

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Product Detailed Parameters

  • Description:2-OUTPUT AUTOMTIVE GRADE MEMS PC
  • Series:DSA557-03
  • PLL:Yes
  • Mfr:Microchip Technology
  • Main Purpose:PCI Express (PCIe)
  • Input:-
  • Output:HCSL, LVCMOS, LVDS
  • Number of Circuits:1
  • Ratio - Input:Output:1:02
  • Differential - Input:Output:No/Yes
  • Frequency - Max:100MHz
  • Voltage - Supply:2.25V ~ 3.63V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:14-VFQFN Exposed Pad
  • Supplier Device Package:14-QFN (2.5x3.2)
  • Grade:-
  • Qualification:-

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DSA557-0344FI1VAO

Overview

The DSA557-0344FI1VAO is a two-output automotive-grade MEMS PCI Express clock generator from Microchip Technology. It provides 100 MHz differential HCSL outputs compliant with PCIe Gen1/2/3/4 common clock specifications. The device utilizes integrated silicon MEMS technology, eliminating the need for external quartz crystals. It operates within a supply voltage range of 2.25V to 3.63V and supports an extended industrial temperature range of -40°C to +85°C. Packaged in a compact 14-lead QFN (2.5x3.2 mm), it features dedicated output enable pins and offers low current consumption.

Feature Summary

  • Automotive AEC-Q100 Qualified for Grade 3 (-40°C to +85°C)
  • Integrated MEMS Resonator eliminates external 25 MHz crystal
  • Complies with PCIe Gen1/2/3/4 Common Clock Spec
  • Two 100 MHz HCSL differential outputs with dedicated OE pins

Applications

  • Automotive Infotainment Systems
  • Automotive ADAS Applications
  • Autonomous Driving Systems
  • In-Vehicle Network Interfaces

Procurement Notes

Verify the specific ordering suffix 'I' corresponds to the -40°C to +85°C temperature range and 'F' indicates the 14-Lead QFN package as defined in the Product Identification System. Confirm that the stability rating associated with the numeric codes matches system requirements. Ensure compatibility with standard automotive qualification standards before finalizing procurement.

Selection Notes

Select this component when designing for automotive environments requiring robust shock and vibration immunity. The integrated MEMS design reduces board space by approximately 77% compared to traditional quartz solutions. Verify that the HCSL output format meets the receiver input requirements; LVDS or LVCMOS options require different ordering suffixes. Ensure power supply filtering includes a 0.1 μF capacitor per VDD pin.

Part Context

This part belongs to the DSA557 series, which replaces quartz and SAW oscillators with silicon MEMS technology. The DSA557-03 variant specifically provides two outputs in a 14-lead QFN package. It serves as a direct replacement for legacy ICs like the ICSS557-03 while offering improved reliability and lower current consumption.

Replacement Considerations

The datasheet identifies the ICSS557-03 as a compatible legacy replacement target. When substituting, verify pinout compatibility between the 14-lead QFN packages and ensure the new MEMS-based jitter performance meets the specific PCIe generation requirements of the host system.

DSA557-0344FI1VAODSA557-0344FI1VAO

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