DSC557-0344FI1B

Overview

The DSC557-0344FI1B is a two-output PCI Express clock generator from Microchip Technology, designed for PCIe Gen1 through Gen4 applications. It utilizes silicon MEMS technology to provide dual 100 MHz HCSL differential outputs without requiring an external 25 MHz crystal. The device operates within a supply voltage range of 2.25V to 3.63V and supports an industrial temperature range of -40°C to +85°C. Packaged in a compact 14-VFQFN (2.5 mm x 3.2 mm) with an exposed pad, it features low power consumption and high shock and vibration immunity.

Feature Summary

• Complies with PCIe Gen1/2/3/4 Common Clock specifications
• Integrated MEMS resonator eliminates the need for an external 25 MHz crystal
• Dual 100 MHz HCSL differential outputs with Output Enable/Disable functionality
• Qualified to MIL-STD-883 for excellent shock and vibration immunity

Applications

• Communications and Networking: Ethernet, Routers, Switches, Gateways, VoIP, Wireless APs, Passive Optical Networks
• Storage Systems: SAN, NAS, SSD, JBOD
• Embedded Applications: Industrial, Medical, Avionics, Security Systems, Office Automation, Digital Signage, POS

Procurement Notes

Verify the specific ordering suffix 'B' against official Microchip documentation to confirm package media or marking variations. Confirm availability status as distribution listings may vary. Ensure compliance with RoHS standards and verify lead-free JEDEC designators on packaging.

Selection Notes

Select this component for designs requiring robust timing solutions in environments subject to mechanical stress due to its MEMS construction and MIL-STD-883 qualification. Choose based on the required output format; this variant provides dual HCSL outputs. Ensure the system operates within the specified 2.25V to 3.63V supply range and -40°C to +85°C temperature envelope.

Part Context

The DSC557-03 belongs to the DSC557 series of PCIe clock generators. It serves as a direct replacement for legacy crystal-based solutions like the ICS557-03, offering reduced board space and improved reliability by integrating the resonator directly into the silicon die.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material.