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DSPIC33CK64MC105-E/M4 is listed in the Microcontrollers range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC MCU 16BIT 64KB FLASH 48UQFN. Review the specifications below when checking this part for your BOM.
The dsPIC33CK64MC105-E/M4 is a 16-bit Digital Signal Controller featuring a high-performance DSP RISC CPU with 40-bit accumulators and single-cycle MAC operations. It integrates 64 Kbytes of Flash memory, 8 Kbytes of SRAM, and supports operation from 3.0V to 3.6V. The device operates up to 100 MHz at -40°C to +125°C and up to 70 MHz at -40°C to +150°C. Key peripherals include four high-speed PWM pairs with 2 ns resolution, a 12-bit ADC with up to 3.5 Msps conversion rate, three operational amplifiers, and multiple communication interfaces including SPI, I2C, and UART.
Verify the specific suffix 'M4' against official Microchip documentation to confirm package type and temperature grade. Ensure compatibility with MPLAB X IDE and required development tools. Check for any functional safety certifications if deploying in ASIL B or beyond applications. Confirm pinout requirements for the 48-pin TQFP/UQFN package.
Select this component for applications requiring high-resolution PWM and fast analog acquisition within a 16-bit architecture. Consider the extended temperature range options (-40°C to +150°C) for harsh environments. Evaluate peripheral availability such as QEI, SENT, and CLC against system interface needs. Verify memory size sufficiency for complex control algorithms and data storage.
This device belongs to the dsPIC33CK family, designed to combine MCU control attributes with DSP computational power. It targets e-mobility and industrial automation markets. The family emphasizes functional safety compliance with IEC 60730 and ISO 26262 standards. It offers small pin count packages ranging from 28 to 48 pins.
Consult the dsPIC33CK family datasheet for other members with similar memory sizes and peripheral sets. Verify pin-to-pin compatibility if substituting within the same package type. Review errata sheets for both source and target devices to ensure operational equivalence.
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