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The DZ23C3V9-HE3_A-08 is a silicon planar Zener diode from the Vishay DZ23 series, housed in an SOT-23 surface-mount package. It features a nominal Zener voltage of 3.9 V with a tolerance of ±5%. The device operates at a test current of 5 mA and provides a maximum reverse leakage current of 3 µA at 2 V. Dynamic resistance is specified at 90 Ω (max) at Izt1 and 500 Ω (max) at Izt2. It is AEC-Q101 qualified for automotive applications, supports a junction temperature up to 150 °C, and offers ESD protection exceeding 8 kV (HBM).
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm that the ordering suffix matches the required AEC-Q101 qualification and reel specifications. Ensure compliance with RoHS directives and check for any specific material categorization requirements relevant to the target application environment.
Select this component when a precise 3.9 V reference is needed within a compact SOT-23 footprint. Consider the dynamic resistance and leakage characteristics for low-current precision tasks. Verify thermal management capabilities if operating near the upper limits of the specified temperature range.
This part belongs to the DZ23 series of small signal Zener diodes manufactured by Vishay Semiconductors. The series covers a wide voltage range from 2.2 V to 75 V, offering standardized grading according to the international E24 standard. These devices are designed for general-purpose voltage regulation and clamping duties in consumer and industrial electronics.
Direct replacements must match the 3.9 V nominal voltage, SOT-23 package, and AEC-Q101 qualification. Verify equivalent dynamic resistance and leakage current specifications to ensure circuit performance remains unchanged during substitution.
The device meets AEC-Q101 standards for ESD capability, providing protection greater than 8 kV using the human body model and greater than 800 V using the machine model.
Yes, the HE3_A suffix indicates that the device is AEC-Q101 qualified, making it suitable for automotive electronic environments.
When mounted on an FR-4 board with the recommended soldering footprint, the maximum power dissipation is 300 mW.