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The DZ23C6V8-HE3_A-18 is a silicon planar Zener diode from the Vishay DZ23 series, housed in an SOT-23 surface-mount package. It features a nominal Zener voltage of 6.8 V with a ±5% tolerance and operates at a test current of 5 mA. The device has a maximum reverse leakage current of 2 µA at 4 V and a dynamic resistance of 8 Ω at IZT1. It is AEC-Q101 qualified for automotive applications, offering high ESD protection (>8 kV HBM). Power dissipation is rated at 500 mW on lead and 300 mW on FR-4 board, with an operating temperature range of -55 °C to +150 °C.
Verify component authenticity by cross-referencing the ordering code DZ23C6V8-HE3_A-18 with official Vishay documentation. Confirm that the HE3_A suffix indicates AEC-Q101 qualification and RoHS compliance as specified in the datasheet. Ensure the supplier provides traceability for automotive-grade semiconductor components.
Select this component when a 6.8 V Zener reference with tight ±5% tolerance is required in a compact SOT-23 footprint. The AEC-Q101 qualification makes it suitable for automotive environments where high ESD immunity and extended temperature operation are necessary. Consider the 300 mW power rating on PCB for thermal management.
This part belongs to the DZ23 series of small signal Zener diodes manufactured by Vishay Semiconductors. The series covers a wide voltage range from 2.2 V to 75 V, graded according to the international E24 standard. The specific HE3_A variant denotes automotive qualification and RoHS compliance within this family.
Direct replacements within the same series include other DZ23C variants with different voltage ratings but identical packaging and qualification standards. Verify that any substitute maintains the required Zener voltage, tolerance, and AEC-Q101 certification for the specific application.
According to AEC-Q101 standards, the device offers an ESD capability of greater than 8 kV using the human body model and greater than 800 V using the machine model.
The total power dissipation is rated at 500 mW when measured with thermal resistance to lead (RthJL = 250 K/W), and reduces to 300 mW when mounted on an FR-4 board with the recommended soldering footprint.
At the test current (IZT1) of 5 mA, the dynamic resistance (ZZ) is specified as a maximum of 8 Ω.