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The DZ23C8V2-HE3_A-18 is a silicon planar Zener diode from the Vishay DZ23 series, housed in an SOT-23 surface-mount package. It provides a nominal Zener voltage of 8.2 V with a tolerance of ±5%. The device operates at a test current of 5 mA and features a maximum reverse leakage current of 0.1 µA at 6.9 V. Dynamic resistance is specified at 7 Ω, with a temperature coefficient ranging from 4 to 7 x 10⁻⁴/°C. Qualified under AEC-Q101 standards, it supports junction temperatures up to 150 °C and offers ESD protection exceeding 8 kV (HBM) and 800 V (MM).
Verify component authenticity by cross-referencing the manufacturer's part number against official Vishay documentation. Confirm that the ordering suffix matches the required tape-and-reel packaging format. Ensure compliance with RoHS directives and AEC-Q101 qualification status before finalizing procurement orders.
Select this component when a precise 8.2 V regulation point is required in space-constrained designs. The SOT-23 footprint allows for automated surface-mount assembly. Verify that the operating current remains near the 5 mA test condition to maintain the specified voltage tolerance and dynamic resistance characteristics.
This device belongs to the DZ23 series of small-signal Zener diodes manufactured by Vishay Semiconductors. The series covers a wide voltage range from 2.2 V to 75 V, all graded according to the international E24 standard. The HE3_A suffix specifically denotes the AEC-Q101 qualified variant packaged in 13-inch reels.
Direct replacements must match the 8.2 V nominal voltage, ±5% tolerance, and SOT-23 package. Verify that any substitute component also holds AEC-Q101 qualification if automotive reliability is required. Check thermal resistance and power dissipation limits to ensure compatibility with existing board layouts.
The device meets AEC-Q101 ESD capability standards, offering protection greater than 8 kV via the human body model and greater than 800 V via the machine model.
For the DZ23C8V2 variant, the temperature coefficient ranges from a minimum of 4 x 10⁻⁴/°C to a maximum of 7 x 10⁻⁴/°C at the test current of 5 mA.
No, the DZ23C8V2-HE3_A-18 is designed for low-power applications with a maximum power dissipation of 500 mW on a heatsink or 300 mW on an FR-4 board.