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E-TA2012 T 4DB N6 is listed in the Attenuators range at ChipApex. The manufacturer field lists Nidec Components Corporation. Its product description is RF ATTENUATOR 4DB 50OHM 0805. Review the specifications below when checking this part for your BOM.
The E-TA2012 T 4DB N6 is a surface-mount RF attenuator manufactured by Nidec Components Corporation. It provides a fixed attenuation of 4 dB with a nominal impedance of 50 Ohms. The component utilizes an 0805 (2012 Metric) package footprint, designed for integration into high-frequency circuitry. It operates within a frequency range of 0 Hz to 3 GHz and supports a maximum power dissipation of 63 mW. The device features gold-plated terminations for reliable signal transmission in compact electronic assemblies.
Verify the specific suffix 'T' against official manufacturer documentation to confirm tape-and-reel packaging or variant specifications. Cross-reference the part number with current availability status, as similar models in this series may have different manufacturing statuses. Ensure compatibility with 0805 footprints and 50-Ohm system requirements before procurement.
Select this component when a fixed 4 dB attenuation is required in a space-constrained RF design. The 0805 package offers a balance between size and thermal performance for low-power applications. Confirm that the 63 mW power rating aligns with the expected signal levels in the target circuit to prevent overheating or performance degradation during operation.
This component belongs to the E-TA2012 series of thin-film chip resistors designed specifically for RF attenuator applications. The series is characterized by stable performance across wide frequency bands and consistent tolerance values. Nidec Components produces these devices to meet the demands of modern electronics requiring miniaturization without compromising signal integrity in high-frequency environments.
Direct substitutes include the PXV1220S-4DBN6-T from Susumu, which offers equivalent electrical characteristics. Verify pin compatibility and thermal handling capabilities when transitioning between manufacturers to ensure seamless integration into existing PCB layouts.
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