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E208GSEQF-BA000-2 is listed in the Memory IC range at ChipApex. The manufacturer field lists Delkin Devices, Inc.. Its product description is IC MEMORY. Review the specifications below when checking this part for your BOM.
Memory IC specifications for E208GSEQF-BA000-2
- Description：IC MEMORY
- Series：-
- Mfr：Delkin Devices, Inc.
- Package：Bulk
- Memory Type：-
- Memory Format：-
- Technology：-
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for E208GSEQF-BA000-2
Memory IC Overview
The E208GSEQF-BA000-2 is an embedded multimedia card (eMMC) manufactured by Delkin Devices, Inc. It features a storage capacity of 8 GB and utilizes Multi-Level Cell (MLC) NAND technology. The component is housed in a 153-ball Flip Chip Ball Grid Array (FCBGA) package with dimensions of 11.5 mm x 13 mm x 1.0 mm. Designed for industrial applications, it operates within a temperature range of -40°C to +105°C. The device complies with the AEC-Q100 automotive qualification standard.
Memory IC Feature Summary
- Complies with AEC-Q100 automotive qualification standards
- Operates reliably across extended industrial temperature ranges
- Utilizes MLC NAND flash memory technology
Memory IC Applications
- Automotive electronic systems requiring robust data storage
- Industrial control units operating in extreme temperatures
- Embedded computing platforms needing high durability
Memory IC Procurement Notes
Verify component authenticity through authorized channels. Confirm that the specific revision matches project requirements. Check for end-of-life status as distributor listings indicate potential discontinuation. Ensure compatibility with existing board layouts and firmware drivers before integration.
Memory IC Selection Notes
Select this part for applications demanding automotive-grade reliability and wide temperature tolerance. Consider the 153-ball FCBGA footprint during PCB design. Evaluate MLC endurance characteristics against system write-cycle requirements. Verify power consumption profiles against thermal management capabilities.
Memory IC Part Context
This eMMC module belongs to Delkin Devices' embedded memory portfolio, targeting sectors requiring high durability. It integrates controller and NAND flash into a compact form factor. The series supports standard interfaces for seamless integration into embedded host systems without complex external wiring.
Memory IC Replacement Considerations
Distributor records indicate this product may be discontinued. Review official manufacturer documentation for current lifecycle status. Identify alternative parts from the same family or compatible pin-to-pin solutions if supply constraints exist.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
