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E316GSEQF-BA000-2 is listed in the Memory IC range at ChipApex. The manufacturer field lists Delkin Devices, Inc.. Its product description is IC MEMORY. Review the specifications below when checking this part for your BOM.
Memory IC specifications for E316GSEQF-BA000-2
- Description：IC MEMORY
- Series：-
- Mfr：Delkin Devices, Inc.
- Package：Bulk
- Memory Type：-
- Memory Format：-
- Technology：-
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for E316GSEQF-BA000-2
Memory IC Overview
The E316GSEQF-BA000-2 is a 16GB eMMC flash memory component manufactured by Delkin Devices, Inc. It utilizes Multi-Level Cell (MLC) technology to provide reliable data storage within a compact form factor. The device features a 153-ball package with physical dimensions of 11.5mm x 13mm x 1.0mm. It is engineered for automotive applications, meeting the AEC-Q100 qualification standard. The component operates reliably across an extended industrial temperature range from -40°C to +85°C, ensuring stability in demanding environments.
Memory IC Feature Summary
- AEC-Q100 qualified for automotive reliability standards
- Extended industrial temperature operation range
- Compact 153-ball MLC eMMC package design
Memory IC Applications
- Automotive infotainment systems
- Vehicle telematics control units
- Industrial embedded storage solutions
Memory IC Procurement Notes
Verify the specific package type and pin configuration against your PCB layout requirements before ordering. Confirm that the operating temperature range meets your environmental specifications. Ensure compatibility with your host controller's eMMC interface version. Check for any required firmware updates or initialization sequences specified in the official datasheet. Validate supply chain authenticity through authorized distributors.
Memory IC Selection Notes
Select this component when automotive-grade reliability and wide temperature tolerance are critical. The 16GB capacity suits moderate storage needs in embedded systems. Consider the 153-ball footprint for space-constrained designs. Evaluate power consumption profiles against system battery constraints. Compare performance metrics with alternative MLC eMMC options if higher throughput is required.
Memory IC Part Context
This part belongs to Delkin Devices' embedded memory portfolio, focusing on robust storage solutions for industrial and automotive sectors. The eMMC format ensures standardized connectivity with various host processors. Its construction emphasizes durability and consistent performance under stress conditions typical of vehicle electronics.
Memory IC Replacement Considerations
Check for compatible eMMC components with identical ball counts and pin assignments. Verify that substitute parts meet the same AEC-Q100 certification and temperature ratings. Ensure software drivers support the replacement chip's command set. Confirm physical dimensions match the existing board space.
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