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EBC10DTAI is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists Sullins Connector Solutions. Its product description is CONN EDGE DUAL FMALE 20POS 0.100. Review the specifications below when checking this part for your BOM.
The EBC10DTAI is a dual-edge female connector manufactured by Sullins Connector Solutions. It features 20 positions arranged in two rows of ten contacts, with a 0.100-inch (2.54mm) centerline spacing. The connector utilizes phosphor bronze contacts with a gold plating thickness of 10.0µin (0.25µm). Designed for through-hole termination via soldering, it accommodates a card thickness of 0.062 inches (1.57mm). The housing is constructed from polybutylene terephthalate (PBT), and the unit operates within a temperature range of -65°C to 125°C.
Verify the specific suffix designation against official manufacturer documentation to confirm exact flange characteristics and terminal style. Ensure compatibility with the target PCB layout regarding hole patterns and mounting hardware specifications. Cross-reference the insulation material grade and operating temperature limits with system environmental requirements before finalizing procurement orders.
Select this component when a dual-edge female interface with 0.100-inch spacing is required for through-hole assembly. Confirm that the 0.062-inch card thickness matches the application's circuit board specifications. Evaluate the need for gold plating thickness and PBT insulation based on environmental exposure and thermal cycling demands.
This part belongs to the EBC series of edgeboard connectors from Sullins Connector Solutions. These components are designed for high-reliability interconnection in demanding environments. The series offers various configurations to accommodate different card types and mounting styles while maintaining consistent electrical performance standards across the product line.
Consult official substitution guides for compatible alternatives. Verify pin count, spacing, and mechanical dimensions to ensure functional equivalence without redesigning the host assembly.
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