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EDB2432B4MA-1DAUT-F-D is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 2GBIT PAR 134VFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for EDB2432B4MA-1DAUT-F-D
- Description：IC DRAM 2GBIT PAR 134VFBGA
- Series：-
- Mfr：Micron Technology Inc.
- Package：Bulk
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM - Mobile LPDDR2
- Memory Size：2Gbit
- Memory Organization：64M x 32
- Memory Interface：Parallel
- Clock Frequency：533 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.14V ~ 1.95V
- Operating Temperature：-40°C ~ 125°C (TC)
- Mounting Type：Surface Mount
- Package / Case：134-VFBGA
- Supplier Device Package：134-VFBGA (10x11.5)
- Access Time：-
Memory IC datasheet and documents for EDB2432B4MA-1DAUT-F-D
Memory IC Overview
The EDB2432B4MA-1DAUT-F-D is a Mobile LPDDR2 SDRAM integrated circuit manufactured by Micron Technology Inc. It provides a storage capacity of 2 Gbit with a parallel data bus width of 32 bits. The device supports a maximum clock frequency of 533 MHz and features an access time of 5.5 ns. It operates within a voltage range of 1.14 V to 1.95 V and functions at temperatures between -40°C and +105°C. The component is housed in a 134-VFBGA package measuring 10x11.5 mm.
Memory IC Feature Summary
- Mobile LPDDR2 architecture optimized for compact, low-power embedded systems
- High-speed parallel interface supporting up to 533 MHz operation
- Extended industrial temperature range suitable for demanding environments
Memory IC Applications
- Mobile devices requiring compact memory solutions
- Embedded systems with low-power constraints
- Industrial control units operating in extreme temperatures
Memory IC Procurement Notes
Verify the specific suffix codes against official Micron documentation to confirm pinout and electrical characteristics. Confirm current availability status as components may be subject to discontinuation notices. Ensure compatibility with host controller interfaces before procurement.
Memory IC Selection Notes
Select this component when a 2 Gbit density with a 32-bit interface is required for mobile or embedded applications. Consider the 134-VFBGA package dimensions for PCB layout constraints. Verify that the host system supports LPDDR2 signaling standards and voltage levels within the specified 1.14 V to 1.95 V range.
Memory IC Part Context
This part belongs to the Micron EDB series of Mobile LPDDR2 DRAMs. These components are designed specifically for portable electronics and embedded applications where space and power efficiency are critical. The series offers various densities and interface widths to accommodate different system requirements.
Memory IC Replacement Considerations
Consult Micron's official substitution guide for verified alternatives. Cross-reference pinouts and electrical specifications carefully. Generic equivalents may not match the exact timing parameters or package dimensions.
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