Memory IC EDFA232A2PB-GD-F-D product image

EDFA232A2PB-GD-F-D

  • Description:IC DRAM 16GBIT PARALLEL 216FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:b9e87fec06e9 Category: Brand:

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EDFA232A2PB-GD-F-D is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 16GBIT PARALLEL 216FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EDFA232A2PB-GD-F-D

  • Description:IC DRAM 16GBIT PARALLEL 216FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR3
  • Memory Size:16Gbit
  • Memory Organization:512M x 32
  • Memory Interface:Parallel
  • Clock Frequency:800 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.14V ~ 1.95V
  • Operating Temperature:-30°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:-
  • Supplier Device Package:216-FBGA (12x12)
  • Access Time:-

Memory IC datasheet and documents for EDFA232A2PB-GD-F-D

EDFA232A2PB-GD-F-D

Memory IC Overview

The EDFA232A2PB-GD-F-D is a Mobile LPDDR3 SDRAM integrated circuit manufactured by Micron Technology Inc. It provides a total memory capacity of 16 Gbit, organized as 512M x 32 bits. The device operates with a clock frequency of 800 MHz and utilizes a parallel memory interface. It functions at a voltage of 1.2V and is housed in a 216-pin VFBGA package measuring 12x12 mm. The component supports an operating temperature range from -30°C to +85°C.

Memory IC Feature Summary

  • Mobile LPDDR3 technology for low power consumption
  • High-speed parallel data interface
  • Compact 216-pin VFBGA packaging

Memory IC Applications

  • Mobile computing devices
  • Embedded storage systems
  • Portable electronics

Memory IC Procurement Notes

Verify the specific suffix GD against JD variants to ensure correct speed binning and temperature ratings. Confirm package integrity upon receipt as these components are sensitive to moisture. Cross-reference the manufacturer's latest datasheet for any updates on electrical characteristics or pin assignments before final integration into design schematics.

Memory IC Selection Notes

Select this part when a 16Gb density with x32 organization is required for mobile applications. Ensure the system design accommodates the 1.2V supply rail and 800 MHz clock requirements. Verify that the PCB layout supports the 216-ball FBGA footprint and thermal dissipation needs for the specified commercial temperature range.

Memory IC Part Context

This component belongs to Micron's Mobile LPDDR3 family, designed for portable devices requiring high bandwidth within strict power constraints. It represents a generation of DRAM optimized for smartphones and tablets, offering improved performance over previous standards while maintaining compatibility with standard mobile interfaces.

Memory IC Replacement Considerations

Direct substitutes may include other Micron LPDDR3 parts with identical 16Gb density and x32 organization. Verify pin-to-pin compatibility and electrical specifications before swapping. Consult official replacement guides for updated series members.

EDFA232A2PB-GD-F-DEDFA232A2PB-GD-F-D

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