EDFA232A2PB-JD-F-R TR

Memory IC Overview

The EDFA232A2PB-JD-F-R TR is a Mobile LPDDR3 SDRAM integrated circuit manufactured by Micron Technology Inc. It provides a total storage capacity of 16 Gbit, organized as 512M x 32 bits. The device operates at a maximum data rate of 933 MHz and utilizes a 1.2V supply voltage. It is housed in a 216-pin VFBGA package with dimensions of 12x12 mm. The component supports parallel interface communication and is designed for mobile applications requiring high bandwidth and low power consumption.

Memory IC Feature Summary

• Mobile LPDDR3 architecture optimized for portable electronic devices
• High-speed parallel interface supporting up to 933 MHz operation
• Low voltage operation at 1.2V for enhanced power efficiency
• Compact 216-pin VFBGA packaging suitable for space-constrained designs

Memory IC Applications

• Smartphones and mobile phones
• Tablets and handheld computing devices
• Wearable electronics
• Mobile broadband modules

Memory IC Procurement Notes

Verify the exact suffix configuration against the manufacturer's official datasheet to ensure compatibility with specific design requirements. Confirm that the RoHS compliance status matches project specifications. Check for dry pack preservation if moisture sensitivity level requires baking prior to assembly. Ensure the supplier provides valid traceability documentation for quality assurance purposes.

Memory IC Selection Notes

Select this component when designing mobile systems requiring 16 Gbit memory density within a compact form factor. Consider the 216-pin VFBGA footprint during PCB layout planning. Evaluate thermal management strategies given the 1.2V operating voltage and high-speed parallel interface characteristics. Ensure the host controller supports LPDDR3 signaling standards for proper integration.

Memory IC Part Context

This part belongs to Micron's Mobile LPDDR3 product family, targeting the consumer electronics market. It represents an evolution in mobile memory technology, offering improved performance over previous generations while maintaining low power profiles. The 16 Gbit capacity addresses growing demands for larger application storage and multitasking capabilities in modern smartphones and tablets.

Memory IC Replacement Considerations

Consult Micron's official cross-reference documents for verified substitute part numbers. Ensure any replacement maintains identical pinout, voltage levels, and timing parameters. Verify package compatibility before substitution to avoid mechanical integration issues.