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Product Detailed Parameters
- Description:IC RF TXRX+MCU BLE 32QFN
- Series:Mighty Gecko
- Mfr:Silicon Labs
- Package:Tray
- Type:TxRx + MCU
- RF Family/Standard:Bluetooth
- Protocol:Bluetooth v5.0, Thread, Zigbee®
- Modulation:2GFSK, 4GFSK, ASK, BPSK, DBPSK, DSSS, GMSK, OOK, OQPSK
- Frequency:2.4GHz
- Data Rate (Max):2Mbps
- Power - Output:19dBm
- Sensitivity:-103.3dBm
- Memory Size:512kB Flash, 64kB RAM
- Serial Interfaces:I2C, I2S, IrDA, SPI, UART, USART
- Voltage - Supply:1.8V ~ 3.8V
- Current - Receiving:9.5mA ~ 10.2mA
- Current - Transmitting:8.5mA
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:32-VFQFN Exposed Pad
- Supplier Device Package:32-QFN (5x5)
- GPIO:31
- Grade:-
- Qualification:-
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Overview
The EFR32MG13P732F512IM32-C is a Mighty Gecko System on Chip from Silicon Labs, designed for 2.4 GHz wireless applications. It integrates an ARM Cortex-M4 core operating at 40 MHz with 512 kB of program memory and 64 kB of RAM. The device supports Bluetooth, Zigbee, and Thread protocols, featuring a maximum output power of 19 dBm and a receive sensitivity of -91.5 dBm. It operates within a voltage range of 1.8 V to 3.8 V, with transmission current of 8.5 mA and reception current of 10.3 mA. The component is housed in a QFN-32 package and functions reliably across temperatures from -40°C to +125°C.
Feature Summary
- Integrates a 40 MHz ARM Cortex-M4 processor with substantial onboard memory for complex protocol stacks
- Supports multi-protocol wireless connectivity including Thread, Zigbee, and Bluetooth Low Energy
- Delivers high RF performance with 19 dBm output power and extended industrial temperature range
Applications
- Smart home lighting and control systems
- Industrial sensor networks requiring Thread or Zigbee mesh connectivity
- Smart locks and access control devices
- HVAC controllers and building automation endpoints
Procurement Notes
Verify the specific suffix 'C' against official Silicon Labs documentation to confirm it denotes the commercial temperature grade variant rather than the standard or reel-packaged versions. Ensure the ordering part number matches the exact pinout and package dimensions required for your PCB footprint. Cross-reference the datasheet revision date to ensure compatibility with your design specifications. Confirm RoHS compliance status directly through the manufacturer's certification documents prior to final procurement approval.
Selection Notes
Select this component when a balance of moderate flash capacity and robust RF performance is required for 2.4 GHz mesh networks. The 512 kB memory accommodates larger application code compared to lower-tier MG13 variants. Consider the QFN-32 package constraints for thermal management and board space. Evaluate if the 40 MHz clock speed meets real-time processing needs for sensor data handling alongside wireless stack operations.
Part Context
This part belongs to the EFR32MG13 Mighty Gecko family, targeting cost-sensitive yet feature-rich wireless IoT applications. It shares the same physical package and core architecture as other MG13 variants but differs in memory size and temperature rating. The series is widely adopted in consumer and industrial sectors for its certified protocol support and integrated PA capabilities, offering a compact solution for single-chip wireless designs.
Replacement Considerations
The EFR32MG13P732F512IM32-DR serves as a direct functional substitute with identical electrical characteristics, differing primarily in packaging format (reel vs. tape). Designers should verify that the target PCB footprint accommodates the specific lead frame configuration of the replacement package variant.
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