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Product Detailed Parameters
- Description:IC RF TXRX+MCU BLE 40QFN
- Series:Mighty Gecko
- Mfr:Silicon Labs
- Package:Tape & Reel (TR)
- Type:TxRx + MCU
- RF Family/Standard:Bluetooth
- Protocol:Bluetooth v5.3
- Modulation:2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
- Frequency:2.4GHz
- Data Rate (Max):2Mbps
- Power - Output:19.5dBm
- Sensitivity:-94.8dBm
- Memory Size:1024kB Flash, 128kB RAM
- Serial Interfaces:ADC, GPIO, I2C, I2S, SPI, IrDA, UART
- Voltage - Supply:1.71V ~ 3.8V
- Current - Receiving:4.4mA ~ 5.1mA
- Current - Transmitting:5mA ~ 156.8mA
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:40-VFQFN Exposed Pad
- Supplier Device Package:40-QFN (5x5)
- GPIO:26
- Grade:-
- Qualification:-
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Overview
The EFR32MG24A020F1024IM40-BR is a 2.4 GHz RF System on Chip from Silicon Labs, housed in a QFN-40 package. It features an ARM Cortex-M33 core operating at 78 MHz with DSP and FPU capabilities. The device includes 1024 kB of Flash memory and 128 kB of RAM. It supports a supply voltage range of 1.71 V to 3.8 V and operates within a temperature range of -40°C to +125°C. Key electrical parameters include a maximum output power of +20 dBm, sensitivity of -94.4 dBm at 1 Mbps GFSK, and receive current of 4.4 mA at 1 Mbps GFSK.
Feature Summary
- Integrates a high-performance 32-bit ARM Cortex-M33 processor with digital signal processing and floating-point units for efficient computation.
- Supports multiple wireless protocols including Matter, Thread, Zigbee, Bluetooth Low Energy, and Bluetooth Mesh over 2.4 GHz.
- Provides advanced direction finding capabilities utilizing Angle of Arrival (AoA) and Angle of Departure (AoD) technologies.
- Includes hardware acceleration for AI/ML tasks via a dedicated matrix-vector processor.
Applications
- Smart home devices requiring Matter and Thread connectivity
- Industrial IoT sensors and actuators
- Smart building automation systems
- Wireless mesh lighting networks
Procurement Notes
Verify the specific suffix BR indicates reel packaging when sourcing components. Confirm the QFN-40 footprint matches the target PCB design. Ensure the +20 dBm power variant aligns with regulatory requirements for the intended deployment region. Cross-reference the manufacturing date code to ensure compliance with current RoHS standards.
Selection Notes
Select this model for applications requiring high transmit power and robust multi-protocol support in a compact form factor. The QFN-40 package offers a balance between pin count and board space. Consider thermal management solutions due to the high output power capability and extended temperature rating. Evaluate memory requirements against the 1 MB Flash and 128 kB RAM allocation.
Part Context
This component belongs to the EFR32MG24 series, designed for secure and low-power wireless connectivity. It shares architectural similarities with other MG24 variants but differs in package type and output power specifications. The series targets complex IoT nodes requiring local processing alongside wireless communication capabilities.
Replacement Considerations
Direct substitutes include EFR32MG24A020F1024IM48-BR for similar performance in a QFN-48 package. For lower power options, consider EFR32MG24A010F1024IM40-BR. Verify pin compatibility and firmware adaptation when switching between package types or power levels.
FAQ
What is the maximum output power of this SoC?
The EFR32MG24A020F1024IM40-BR supports a maximum output power of +20 dBm.
Does this chip support Angle of Arrival positioning?
Yes, the device supports direction finding using both Angle of Arrival (AoA) and Angle of Departure (AoD).
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