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Product Detailed Parameters
- Description：IC RF TXRX+MCU 802.15.4 40QFN
- Series：-
- Mfr：Silicon Labs
- Package：Tray
- Type：TxRx + MCU
- RF Family/Standard：802.15.4, Bluetooth
- Protocol：Bluetooth v5.0, Zigbee®
- Modulation：DSSS, GFSK, GMSK, OOK, O-QPSK
- Frequency：2.4GHz
- Data Rate (Max)：2Mbps
- Power - Output：6dBm
- Sensitivity：-106.7dBm
- Memory Size：768kB Flash, 64kB RAM
- Serial Interfaces：GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
- Voltage - Supply：0.8V ~ 1.7V
- Current - Receiving：3.6mA ~ 4mA
- Current - Transmitting：4.1mA ~ 11.3mA
- Operating Temperature：-40°C ~ 125°C
- Mounting Type：Surface Mount
- Package / Case：40-VFQFN Exposed Pad
- Supplier Device Package：40-QFN (5x5)
- GPIO：25
- Grade：-
- Qualification：-
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Overview
The EFR32MG27C230F768IM40-B is a wireless System on Chip (SoC) from Silicon Labs, featuring an ARM Cortex-M33 core operating at up to 76.8 MHz. It supports 2.4 GHz frequency bands with a maximum data rate of 2 Mbps and provides +6 dBm output power. The device includes 768 kB of flash memory and 64 kB of RAM. Electrical specifications indicate a supply voltage range of 1.71 V to 3.8 V, with receive current ranging from 3.6 mA to 4 mA and transmit current from 4.1 mA to 11.3 mA. Sensitivity is rated at -96.3 dBm. It operates within a temperature range of -40°C to +125°C and utilizes a QFN-40 package.
Feature Summary
- Integrates an ARM Cortex-M33 processor for efficient code execution in IoT applications.
- Supports Bluetooth v5.0 and Zigbee protocols for versatile wireless connectivity.
- Features high sensitivity and robust output power for reliable communication.
- Includes multiple serial interfaces such as SPI, UART, I2C, and I2S.
Applications
- Smart home devices requiring BLE and Zigbee support
- Industrial sensor nodes operating in wide temperature ranges
- Wireless mesh networking equipment
- IoT gateways and hubs
Procurement Notes
Verify the specific suffix 'B' against the manufacturer's latest datasheet to confirm pinout and electrical characteristics match your design requirements. Ensure compatibility with the QFN-40 exposed pad thermal management strategy during PCB layout. Confirm that the selected packaging format aligns with your assembly capabilities.
Selection Notes
Select this component when a combination of Bluetooth and Zigbee support is required alongside a high-performance ARM Cortex-M33 core. The wide operating temperature range makes it suitable for industrial environments. Consider the 768 kB flash capacity for complex application logic and the 2.4 GHz band for global interoperability.
Part Context
This part belongs to the EFR32MG27 series, designed for multiprotocol wireless applications. It shares architectural similarities with other MG27 variants but differs in memory size and package configuration. The C230 designation typically indicates specific memory and feature sets within the Blue Gecko family.
Replacement Considerations
Direct substitutes include EFR32MG27C230F768IM40-BR for reel packaging or EFR32BG27C230F768IM40-B if Bluetooth-only functionality suffices. Verify pin-to-pin compatibility and firmware portability before switching between BG and MG series variants.
