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Product Detailed Parameters
- Description：IC RF TXRX+MCU 802.15.4 40QFN
- Series：EFR32™ Blue Gecko
- Mfr：Silicon Labs
- Package：Tape & Reel (TR)
- Type：TxRx + MCU
- RF Family/Standard：802.15.4, Bluetooth
- Protocol：Bluetooth v5.0, Zigbee®
- Modulation：DSSS, GFSK, GMSK, OOK, O-QPSK
- Frequency：2.4GHz
- Data Rate (Max)：2Mbps
- Power - Output：6dBm
- Sensitivity：-106.7dBm
- Memory Size：768kB Flash, 64kB RAM
- Serial Interfaces：GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
- Voltage - Supply：0.8V ~ 1.7V
- Current - Receiving：3.6mA ~ 4mA
- Current - Transmitting：4.1mA ~ 11.3mA
- Operating Temperature：-40°C ~ 125°C
- Mounting Type：Surface Mount
- Package / Case：40-VFQFN Exposed Pad
- Supplier Device Package：40-QFN (5x5)
- GPIO：25
- Grade：-
- Qualification：-
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Overview
The EFR32MG27C230F768IM40-BR is a multiprotocol wireless System on Chip (SoC) from Silicon Labs, integrating an ARM Cortex-M33 processor with a 2.4 GHz RF transceiver. It features 768 kB of flash memory and 64 kB of RAM. The device supports Bluetooth v5.0, Zigbee, and IEEE 802.15.4 protocols. Key electrical parameters include a maximum output power of 6 dBm, receive sensitivity of -106.7 dBm, and a supply voltage range of 0.8 V to 1.7 V. Operating currents are specified as 3.6 mA to 4 mA during reception and 4.1 mA to 11.3 mA during transmission. It operates within a temperature range of -40°C to 125°C and utilizes a 40-VFQFN package.
Feature Summary
- Supports multiprotocol connectivity including Bluetooth v5.0, Zigbee, and IEEE 802.15.4 standards for versatile wireless communication.
- Integrates an ARM Cortex-M33 core with hardware acceleration capabilities for efficient processing of complex tasks.
- Features a high-performance 2.4 GHz radio transceiver with optimized current consumption profiles for battery-powered applications.
Applications
- Smart home devices requiring Zigbee or Bluetooth connectivity
- Industrial sensor nodes operating in wide temperature ranges
- Wireless mesh network endpoints supporting IEEE 802.15.4
Procurement Notes
Verify the specific suffix 'BR' indicates tape-and-reel packaging configuration when ordering. Confirm that the MG27 variant aligns with required firmware compatibility, distinct from BG27 series. Ensure design-in accounts for the exposed pad thermal requirements of the QFN40 package. Cross-reference the latest errata documents for any silicon revisions affecting performance characteristics.
Selection Notes
Select this component for applications requiring simultaneous support for multiple 2.4 GHz wireless protocols within a compact form factor. The 768 kB flash capacity accommodates complex protocol stacks and application code. Consider the 0.8 V minimum supply voltage for ultra-low-power operation scenarios. Evaluate the 6 dBm output power against link budget requirements for intended deployment distances.
Part Context
This part belongs to the EFR32MG27 Blue Gecko series, designed for multiprotocol wireless IoT applications. It complements the BG27 series by offering specific optimizations for mixed-protocol environments. The MG27 designation distinguishes it from sub-GHz variants, focusing exclusively on 2.4 GHz operations. It serves as a central processing unit for smart building and industrial automation networks.
Replacement Considerations
EFR32BG27C230F768IM40-BR shares identical pinout and package dimensions but targets primarily Bluetooth Low Energy applications rather than multiprotocol use cases.
