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Product Detailed Parameters
- Description：IC RF TXRX+MCU BLE 40QFN
- Series：-
- Mfr：Silicon Labs
- Package：Tray
- Type：TxRx + MCU
- RF Family/Standard：Bluetooth, General ISM < 1GHz
- Protocol：Bluetooth
- Modulation：2-FSK, 4-FSK, 2-GFSK, 4-GFSK, DSSS
- Frequency：902MHz ~ 928MHz
- Data Rate (Max)：50kbps
- Power - Output：20dBm
- Sensitivity：-109.5dBm
- Memory Size：512kB Flash, 64kB RAM
- Serial Interfaces：GPIO, I2C, I2S, IrDA, PWM, SPI, UART, USART
- Voltage - Supply：1.71V ~ 3.8V
- Current - Receiving：4mA
- Current - Transmitting：85.5mA
- Operating Temperature：-40°C ~ 125°C (TA)
- Mounting Type：Surface Mount
- Package / Case：40-VFQFN Exposed Pad
- Supplier Device Package：40-QFN (5x5)
- GPIO：23
- Grade：-
- Qualification：-
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Overview
The EFR32SG23B020F512IM40-C is a Sub-GHz System on Chip (SoC) from Silicon Labs, integrating an ARM Cortex-M33 processor with a high-performance RF transceiver. It features 512kB of flash memory and 64kB of RAM within a 40-VFQFN package. The device supports multiple frequency bands including 902MHz to 928MHz and delivers up to +20dBm output power. It offers -110.1dBm sensitivity and operates on a supply voltage of 1.71V to 3.8V across a temperature range of -40°C to 125°C.
Feature Summary
- Integrates ARM Cortex-M33 core with Sub-GHz RF capabilities for efficient IoT processing
- Includes Secure Vault-High security module for robust data protection
- Supports Amazon Sidewalk protocol for extended connectivity in smart home applications
Applications
- Smart home devices requiring long-range sub-GHz communication
- Amazon Sidewalk compatible endpoints for community network participation
- Industrial IoT sensors operating in harsh environmental conditions
Procurement Notes
Verify the specific suffix 'C' against the latest manufacturer datasheet to confirm current production status and any recent assembly or marking changes. Ensure compatibility with required regulatory certifications for target markets. Cross-reference pinout details with official ECAD models before PCB layout finalization to prevent integration errors.
Selection Notes
Select this component when high output power (+20dBm) and extended range are critical for sub-GHz applications. It is suitable for designs requiring integrated security features via Secure Vault-High. Consider the 40-pin QFN footprint constraints and thermal management requirements associated with the exposed pad design during hardware planning.
Part Context
This part belongs to the EFR32SG23 series, designed specifically for Sub-GHz wireless applications. It complements other members like the FG23 and MG22 series by offering optimized performance for low-power, long-range communication needs in the Internet of Things ecosystem, particularly focusing on secure and reliable data transmission.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Evaluate alternative models within the EFR32 family based on specific power, memory, and frequency band requirements.
