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EL817(S)(C)(TB)-G
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Product Detailed Parameters
- Description：OPTOISOLATOR 5KV 1CH TRANS 4-SMD
- Series：-
- Mfr：Everlight Electronics Co Ltd
- Package：Tape & Reel (TR)
- Number of Channels：1
- Voltage - Isolation：5000Vrms
- Current Transfer Ratio (Min)：200% @ 5mA
- Current Transfer Ratio (Max)：400% @ 5mA
- Turn On / Turn Off Time (Typ)：-
- Rise / Fall Time (Typ)：6µs, 8µs
- Input Type：DC
- Output Type：Transistor
- Voltage - Output (Max)：80V
- Current - Output / Channel：50mA
- Voltage - Forward (Vf) (Typ)：1.2V
- Current - DC Forward (If) (Max)：60 mA
- Vce Saturation (Max)：200mV
- Operating Temperature：-55°C ~ 110°C
- Mounting Type：Surface Mount
- Package / Case：4-SMD, Gull Wing
- Supplier Device Package：4-SMD
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Overview
The EL817(S)(C)(TB)-G is a single-channel transistor output optocoupler manufactured by Everlight Electronics Co Ltd. It features an infrared emitting diode optically coupled to an NPN phototransistor detector in a surface-mount package. The device provides high isolation voltage of 5000 Vrms between input and output circuits. Key electrical parameters include a minimum collector-emitter breakdown voltage of 35 V, maximum forward current of 60 mA, and maximum collector current of 50 mA. The current transfer ratio ranges from 200% to 600% at IF=5mA and VCE=5V. It operates within a temperature range of -55°C to +110°C.
Feature Summary
- High isolation voltage capability between input and output channels
- Compact small outline surface mount package design
- Wide operating temperature range for industrial applications
Applications
- Industrial control systems requiring signal isolation
- Power supply feedback loops
- Communication interface isolation
Procurement Notes
Verify the specific suffix configuration against official Everlight documentation to ensure correct lead spacing and tape reel type compatibility with automated assembly equipment. Confirm RoHS compliance status and UL/VDE recognition numbers match project requirements. Cross-reference datasheet revisions to validate parameter consistency before finalizing component selection.
Selection Notes
Select this component when surface mounting space constraints require a compact footprint while maintaining high isolation standards. Ensure circuit design accommodates the specified current transfer ratio variations and thermal limits. Verify that the SMD package orientation matches PCB layout guidelines for optimal solder joint reliability during reflow processes.
Part Context
This part belongs to the EL817 series of photocouplers, which utilize infrared LEDs coupled to phototransistors. The series offers various packaging options including DIP and SMD configurations. The EL817(S)(C)(TB)-G specifically denotes the surface mount variant with defined lead bending and tape/reel packaging suitable for high-volume manufacturing environments.
Replacement Considerations
Consult official Everlight substitution lists for verified equivalents. Generic replacements may not match the precise creepage distance or isolation voltage ratings required for safety-certified designs.
