Memory IC EM004LXQBB313ES1R product image

EM004LXQBB313ES1R

$10.84
  • Description:IC RAM 4MBIT XSPI/QUAD 24TBGA
  • Series:EMxxLX
  • Mfr:Everspin Technologies Inc.
  • Package:Tape & Reel (TR)

SKU:a4125fb5b6d6 Category: Brand:

  
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EM004LXQBB313ES1R is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 4MBIT XSPI/QUAD 24TBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EM004LXQBB313ES1R

  • Description:IC RAM 4MBIT XSPI/QUAD 24TBGA
  • Series:EMxxLX
  • Mfr:Everspin Technologies Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:RAM
  • Technology:MRAM (Magnetoresistive RAM)
  • Memory Size:4Mbit
  • Memory Organization:512K x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TBGA (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for EM004LXQBB313ES1R

EM004LXQBB313ES1R

Memory IC Overview

The EM004LXQBB313ES1R is a 4 Mbit Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a Quad SPI interface and operates within a voltage range of 1.65 V to 2 V. The memory organization is specified as 512 k x 8 bits. The device supports clock frequencies up to 133 MHz and functions reliably across an extended industrial temperature range from -40°C to +105°C. It is housed in a compact 24-ball BGA package designed for surface mount technology applications.

Memory IC Feature Summary

  • Non-volatile data retention capability inherent to MRAM technology
  • High-speed Quad SPI serial communication interface
  • Extended industrial operating temperature range support

Memory IC Applications

  • Industrial control systems requiring persistent storage
  • Automotive electronics with high thermal tolerance needs
  • Embedded systems needing fast boot-up times

Memory IC Procurement Notes

Verify the specific suffix 'S1R' against official Everspin documentation to confirm tape-and-reel packaging specifications. Ensure compatibility with the required 24-BGA footprint during PCB layout. Confirm that the supply chain source provides authentic components, as availability may be restricted in certain regions.

Memory IC Selection Notes

Select this component when non-volatile storage with read/write endurance comparable to SRAM is required. The Quad SPI interface offers higher throughput than standard SPI variants. Consider the 24-BGA package constraints and ensure the design accommodates the specified 1.65 V to 2 V power supply requirements.

Memory IC Part Context

This part belongs to the EMxxLX series of MRAM devices from Everspin Technologies. It shares architectural similarities with other members like EM004LXQBB313IS2T but differs in packaging type and potentially temperature grade variations. The series is designed for applications demanding high reliability and speed without the write-cycle limitations of flash memory.

Memory IC Replacement Considerations

EM004LXQBB313ES2T is listed as a suggested alternate part number. Verify if the suffix change indicates a difference in packaging or temperature rating before substitution.

EM004LXQBB313ES1REM004LXQBB313ES1R
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