Memory IC EM008LXQBB313ES2R product image

EM008LXQBB313ES2R

$16.46
  • Description:IC RAM 8MBIT XSPI 24TBGA
  • Series:EMxxLX
  • Mfr:Everspin Technologies Inc.
  • Package:Tape & Reel (TR)

SKU:0e1ba513f137 Category: Brand:

  
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EM008LXQBB313ES2R is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 8MBIT XSPI 24TBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EM008LXQBB313ES2R

  • Description:IC RAM 8MBIT XSPI 24TBGA
  • Series:EMxxLX
  • Mfr:Everspin Technologies Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:RAM
  • Technology:MRAM (Magnetoresistive RAM)
  • Memory Size:8Mbit
  • Memory Organization:1M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TBGA (6x8)
  • Access Time:7 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for EM008LXQBB313ES2R

EM008LXQBB313ES2R

Memory IC Overview

The EM008LXQBB313ES2R is an 8 Mbit Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a Quad SPI interface and operates within a supply voltage range of 1.65 V to 2 V. The device is organized as 1 M x 8 bits and supports clock frequencies up to 133 MHz. It is housed in a 24-BGA package with surface mount installation. The component is rated for industrial temperature operation from -40°C to +105°C.

Memory IC Feature Summary

  • Non-volatile data retention capability inherent to MRAM technology
  • High-speed Quad SPI serial communication interface
  • Industrial-grade wide operating temperature range

Memory IC Applications

  • Embedded systems requiring persistent storage
  • Industrial control applications
  • Automotive electronics modules

Memory IC Procurement Notes

Verify the specific suffix against official documentation, as standard listings typically indicate ES2T for BGA-24 packaging. Confirm RoHS compliance status directly with the manufacturer or authorized distributors prior to procurement. Ensure design-in compatibility with the specified 24-BGA footprint and thermal requirements.

Memory IC Selection Notes

Select this component when non-volatility and high endurance are required without the complexity of flash programming algorithms. The Quad SPI interface offers faster read speeds compared to standard SPI variants. Verify that the 1.65 V to 2 V supply voltage aligns with the system power architecture and that the BGA-24 package fits the PCB layout constraints.

Memory IC Part Context

This part belongs to the Everspin EM008L series of MRAM devices. These components utilize spin-transfer torque magnetic tunnel junctions to provide fast, reliable, and durable memory solutions. The series is designed to replace traditional volatile SRAM and non-volatile flash memory in applications demanding high write endurance and instant data access.

Memory IC Replacement Considerations

EM008LXQBB313ES1T is listed as a suggested alternate part number for this component family.

EM008LXQBB313ES2REM008LXQBB313ES2R
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