EM008LXQBB313IS1R

Memory IC Overview

The EM008LXQBB313IS1R is a magnetic random-access memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features an 8 Mbit storage capacity organized as 1 M x 8 bits. The device utilizes a Quad SPI interface and operates within a voltage range of 1.65 V to 2 V. It is housed in a 24-ball BGA package suitable for surface mount technology. The component supports operating temperatures from -40°C to +85°C and includes moisture sensitivity classification.

Memory IC Feature Summary

• Non-volatile magnetic storage technology providing data retention without power
• Quad Serial Peripheral Interface for high-speed communication
• Surface-mount BGA packaging optimized for compact board layouts

Memory IC Applications

• Industrial control systems requiring persistent data storage
• Automotive electronics with temperature resilience requirements
• Embedded systems needing fast boot-up times

Memory IC Procurement Notes

Verify the specific suffix codes against official datasheets to ensure correct voltage and temperature ratings. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly. Check for RoHS compliance documentation. Ensure supply chain availability matches project timelines due to potential distribution restrictions.

Memory IC Selection Notes

Select this component when non-volatility and high endurance are critical compared to flash memory. Consider the Quad SPI interface speed and low voltage operation for power-constrained designs. Evaluate the BGA footprint constraints during PCB layout. Compare thermal performance against application environmental limits.

Memory IC Part Context

This part belongs to the EMxxLX series of MRAM devices from Everspin Technologies. The series focuses on providing reliable, high-performance memory solutions using spin-transfer torque magnetoresistive technology. These components are designed to replace traditional volatile and non-volatile memory types in demanding applications.