EM008LXQBB313IS2R

Memory IC Overview

The EM008LXQBB313IS2R is an 8 Mbit Magnetoresistive Random Access Memory (MRAM) IC manufactured by Everspin Technologies. It features a Quad SPI interface operating at frequencies up to 133 MHz. The device utilizes a 24-TBGA package with dimensions of 6x8 mm. Electrical specifications include a supply voltage range from 1.65 V to 2 V and a memory organization of 1 M x 8. Operating temperatures extend from -40°C to +105°C, supporting industrial applications.

Memory IC Feature Summary

• Provides non-volatile data retention without requiring power for storage maintenance
• Supports high-speed data transfer via Quad SPI interface with up to four I/O signals
• Enables direct code execution from memory due to random access capabilities

Memory IC Applications

• Industrial control systems requiring persistent memory
• Data logging in environments with frequent power cycling
• Embedded firmware storage in IoT devices

Memory IC Procurement Notes

Verify the specific suffix 'IS2R' against official Everspin documentation to confirm temperature grade and tape-and-reel packaging configuration. Ensure compatibility with existing PCB footprints for the 24-TBGA package. Cross-reference electrical parameters with system requirements before finalizing procurement decisions.

Memory IC Selection Notes

Select this component when non-volatility and high endurance are required alongside fast read/write speeds. Compare capacity options within the EM008 family if different memory densities are needed. Verify that the 1.65 V to 2 V supply range aligns with the target system's power architecture.

Memory IC Part Context

This part belongs to the Everspin UNISYST MRAM family, designed for unified code and data memory applications. These devices replace traditional flash or SRAM solutions in scenarios demanding high write endurance and instant boot times. The technology leverages magnetic tunnel junctions for reliable data storage.

Memory IC Replacement Considerations

EM008LXQBB313ES2T is listed as a suggested alternate variant. Verify differences in temperature rating and packaging between these parts before substitution.