EM016LXQBB313CS1R

Memory IC Overview

The EM016LXQBB313CS1R is an 8 Mbit Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a Quad SPI interface operating at 133 MHz and is housed in a 24-BGA package. The device supports a memory organization of 1 M x 8. It operates within a supply voltage range of 1.65 V to 2 V, with typical working power currents of 124 mA and 156 mA. The component is designed for surface mount technology (SMD/SMT) installation and functions reliably within an industrial temperature range from 0°C to +70°C.

Memory IC Feature Summary

• Non-volatile data retention capability inherent to MRAM technology
• Quad Serial Peripheral Interface (SPI) for high-speed communication
• Industrial temperature range operation up to +70°C

Memory IC Applications

• Data logging systems requiring non-volatile storage
• Embedded control units needing fast boot times
• Industrial automation controllers

Memory IC Procurement Notes

Verify the specific suffix 'CS1R' against the manufacturer's current datasheet to confirm package type and tape-and-reel specifications. Ensure the Quad SPI variant matches system requirements, as Octal SPI options exist within the same family. Confirm availability status directly with authorized distributors, as stock levels may vary.

Memory IC Selection Notes

Select this part when a 8 Mbit capacity with Quad SPI interface is required. Compare with the EM016LXOBB320 series if higher speed or Octal SPI is needed. Verify that the 1.65V to 2V supply voltage aligns with the target system's power rails. Check the BGA-24 footprint compatibility during PCB layout design.

Memory IC Part Context

This component belongs to the EMxxLX series of MRAM devices from Everspin Technologies. These devices are characterized by high performance, multiple I/O options, and SPI compatibility. The series offers various capacities and interface speeds, including Quad and Octal SPI variants, packaged in compact BGA formats suitable for space-constrained applications.

Memory IC Replacement Considerations

EM008LXQBB313CS1R: Same interface and package but lower capacity (4 Mbit). EM016LXQBB313IS1R: Similar capacity and interface but potentially different temperature grade or suffix variations.