EM016LXQBB313CS1T

Memory IC Overview

The EM016LXQBB313CS1T is a 16 Mbit Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a Quad SPI interface operating at frequencies up to 133 MHz and utilizes a 24-BGA package for surface mount installation. The device operates within a supply voltage range of 1.65 V to 2 V, with specified working power currents of 124 mA and 156 mA. It supports an industrial temperature range from 0°C to +70°C and includes moisture sensitivity classification.

Memory IC Feature Summary

• Non-volatile magnetic storage technology providing instant-on capability without initialization delays.
• Quad SPI interface enabling high-speed data transfer rates up to 133 MHz.
• Robust endurance characteristics suitable for frequent write-intensive applications.

Memory IC Applications

• Industrial control systems requiring reliable non-volatile data retention.
• Automotive electronics demanding high endurance and wide temperature stability.
• IoT endpoints needing low-power persistent memory solutions.

Memory IC Procurement Notes

Verify the specific suffix CS1T against official datasheets to confirm pinout and thermal specifications. Ensure compatibility with the 24-BGA footprint during PCB layout. Confirm moisture sensitivity level requirements for reflow soldering processes. Validate supply voltage constraints between 1.65 V and 2 V for target system design.

Memory IC Selection Notes

Select this component when high-density non-volatile storage is required in a compact BGA form factor. Consider the 133 MHz Quad SPI speed for bandwidth-sensitive interfaces. Evaluate the 0°C to +70°C operating range against environmental conditions. Compare power consumption metrics of 124 mA and 156 mA with system battery life requirements.

Memory IC Part Context

This part belongs to the EMxxLX series of MRAM devices from Everspin Technologies. The series offers scalable densities with Quad SPI interfaces. The EM016 variant specifically provides 16 Mbit capacity. The BGA packaging option facilitates dense board layouts compared to DFN alternatives in the same family.

Memory IC Replacement Considerations

EM016LXQBB313CS2T is listed as a suggested alternate part number by distributors. Verify if suffix differences indicate variations in qualification or packaging before substitution.