EM016LXQBB313CS2T

$15.90

Description：IC RAM 16MBIT XSPI 24TBGA
Series：EMxxLX
Mfr：Everspin Technologies Inc.
Package：Tray

SKU:4bd81bd3ba60 Category: Memory IC Brand: Everspin Technologies Inc.

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Product introduction

EM016LXQBB313CS2T is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 16MBIT XSPI 24TBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EM016LXQBB313CS2T

Description：IC RAM 16MBIT XSPI 24TBGA
Series：EMxxLX
Mfr：Everspin Technologies Inc.
Package：Tray
Memory Type：Non-Volatile
Memory Format：RAM
Technology：MRAM (Magnetoresistive RAM)
Memory Size：16Mbit
Memory Organization：2M x 8
Memory Interface：SPI - Quad I/O
Clock Frequency：133 MHz
Write Cycle Time - Word, Page：-
Voltage - Supply：1.65V ~ 2V
Operating Temperature：0°C ~ 70°C (TA)
Mounting Type：Surface Mount
Package / Case：24-TBGA
Supplier Device Package：24-TBGA (6x8)
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for EM016LXQBB313CS2T

EM016LXQBB313CS2T

Memory IC Overview

The EM016LXQBB313CS2T is a magnetoresistive random-access memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a storage capacity of 16 Mbit organized as 2 M x 8 bits. The device utilizes a Quad SPI interface and operates at frequencies up to 133 MHz. It is housed in a 24-ball BGA package designed for surface mount technology. Electrical specifications include a minimum supply voltage of 1.65 V and a maximum of 2 V. Operating currents are specified at 124 mA and 156 mA under different conditions. The component supports an industrial temperature range from 0 C to +70 C.

Memory IC Feature Summary

Non-volatile data retention capability inherent to MRAM technology
Quad Serial Peripheral Interface (SPI) connectivity for high-speed data transfer
Spin-transfer torque magnetic memory architecture

Memory IC Applications

Industrial control systems requiring persistent data storage
Automotive electronics applications within the specified temperature range
Embedded systems needing fast boot-up times and high endurance

Memory IC Procurement Notes

Verify the specific suffix codes against official datasheets to confirm voltage, temperature, and packaging variations. Ensure compatibility with existing PCB footprints for the 24-BGA package. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly. Check for RoHS compliance status through manufacturer documentation.

Memory IC Selection Notes

Select this component when non-volatile memory with unlimited write endurance is required. Consider the 1.65 V to 2 V operating voltage range for power budget alignment. Evaluate the 24-BGA package size against available board space. Verify that the Quad SPI interface matches the controller's communication capabilities.

Memory IC Part Context

This part belongs to the EMxxLX series of MRAM devices from Everspin Technologies. These devices are characterized by high performance and multiple I/O options. The series offers SPI-compatible interfaces suitable for replacing traditional flash or EEPROM solutions in applications demanding higher speed and durability.