Memory IC EM016LXQBB313ES1R product image

EM016LXQBB313ES1R

$17.46
  • Description:IC RAM 16MBIT XSPI/QUAD 24TBGA
  • Series:EMxxLX
  • Mfr:Everspin Technologies Inc.
  • Package:Tape & Reel (TR)

SKU:c38449c8dc84 Category: Brand:

  
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EM016LXQBB313ES1R is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 16MBIT XSPI/QUAD 24TBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EM016LXQBB313ES1R

  • Description:IC RAM 16MBIT XSPI/QUAD 24TBGA
  • Series:EMxxLX
  • Mfr:Everspin Technologies Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:RAM
  • Technology:MRAM (Magnetoresistive RAM)
  • Memory Size:16Mbit
  • Memory Organization:2M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TBGA (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for EM016LXQBB313ES1R

EM016LXQBB313ES1R

Memory IC Overview

The EM016LXQBB313ES1R is a 16 Mbit Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a Quad SPI interface operating at frequencies up to 133 MHz and is housed in a 24-BGA package. The device supports a memory organization of 2 M x 8 bits. It operates within a supply voltage range of 1.65 V to 2 V, with specified working power currents of 124 mA and 156 mA. The component is designed for surface mount technology (SMD/SMT) installation.

Memory IC Feature Summary

  • Non-volatile data retention utilizing magnetoresistive random access memory technology
  • High-speed Quad Serial Peripheral Interface (SPI) communication capability
  • Compact 24-ball Ball Grid Array (BGA) form factor for space-constrained designs

Memory IC Applications

  • Industrial control systems requiring persistent data storage
  • Automotive electronics demanding high-temperature reliability
  • Consumer devices needing fast boot-up times and low power consumption

Memory IC Procurement Notes

Verify the specific suffix 'ES1R' against official Everspin documentation to confirm tape-and-reel packaging and temperature grade specifications. Ensure compatibility with existing PCB footprints for the 24-BGA package. Confirm that the 1.65 V to 2 V supply voltage requirements align with the target system's power rails before finalizing procurement orders.

Memory IC Selection Notes

Select this component when non-volatility and high endurance are critical, as MRAM offers unlimited write cycles compared to flash. The Quad SPI interface provides higher throughput than standard SPI alternatives. Consider the 24-BGA package size relative to board space constraints. Verify that the operating temperature range meets the environmental conditions of the intended application site.

Memory IC Part Context

This part belongs to the EMxxLX series of MRAM devices from Everspin Technologies. These components are engineered to bridge the performance gap between volatile SRAM and non-volatile flash memory. The series emphasizes speed, durability, and low power consumption, making them suitable for modern embedded applications where data integrity and rapid access are paramount.

Memory IC Replacement Considerations

EM016LXQBB313ES2R is listed as a suggested alternate part number. Verify pinout compatibility and electrical characteristics before substitution.

EM016LXQBB313ES1REM016LXQBB313ES1R
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