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EM016LXQBDH13ES1R is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 16MB XSPI/QUAD 8DFN. Review the specifications below when checking this part for your BOM.
Memory IC specifications for EM016LXQBDH13ES1R
- Description：IC RAM 16MB XSPI/QUAD 8DFN
- Series：EMxxLX
- Mfr：Everspin Technologies Inc.
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：RAM
- Technology：MRAM (Magnetoresistive RAM)
- Memory Size：16Mbit
- Memory Organization：2M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：133 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-VDFN Exposed Pad
- Supplier Device Package：8-DFN (5x6)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for EM016LXQBDH13ES1R
Memory IC Overview
The EM016LXQBDH13ES1R is a 16 Mbit Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a Quad SPI interface operating at frequencies up to 133 MHz and utilizes an 8-DFN package for surface mount installation. The device provides a memory organization of 2 M x 8 bits and operates within a supply voltage range of 1.65 V to 2 V. It supports industrial temperature ranges from -40°C to +105°C, ensuring reliable performance in demanding environments.
Memory IC Feature Summary
- Non-volatile MRAM technology providing instant-on capability without initialization delays.
- Quad SPI interface supporting high-speed data transfer rates up to 133 MHz.
- Robust endurance characteristics suitable for frequent write-intensive applications.
Memory IC Applications
- Industrial control systems requiring non-vatile data retention
- Automotive electronics operating in extreme temperature conditions
- IoT devices needing low power consumption and fast boot times
Memory IC Procurement Notes
Verify the specific suffix 'R' indicates reel packaging when sourcing. Confirm the manufacturer part number matches exactly to ensure correct interface speed and package type. Check for RoHS compliance status as indicated in official documentation. Ensure compatibility with existing PCB footprints for the 8-DFN configuration before procurement.
Memory IC Selection Notes
Select this component for designs requiring high-density non-volatile storage with rapid access speeds. The 16 Mbit capacity fits applications needing substantial code or data storage. Consider the 8-DFN package size for space-constrained layouts. Verify that the system voltage aligns with the 1.65 V to 2 V operating range.
Memory IC Part Context
This part belongs to the EMxxLX series of MRAM devices from Everspin Technologies. It represents a solution bridging the gap between volatile SRAM speed and non-volatile flash density. The series emphasizes durability and energy efficiency for modern embedded systems.
Memory IC Replacement Considerations
EM016LXQBDH13ES2R is listed as a suggested alternate part number. Verify pinout and electrical specifications match before substitution.
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