Memory IC EM016LXQBDH13ES2R product image

EM016LXQBDH13ES2R

$18.81
  • Description:IC RAM 16MBIT XSPI 8DFN
  • Series:EMxxLX
  • Mfr:Everspin Technologies Inc.
  • Package:Tape & Reel (TR)

SKU:4891255c7aae Category: Brand:

  
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EM016LXQBDH13ES2R is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 16MBIT XSPI 8DFN. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EM016LXQBDH13ES2R

  • Description:IC RAM 16MBIT XSPI 8DFN
  • Series:EMxxLX
  • Mfr:Everspin Technologies Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:RAM
  • Technology:MRAM (Magnetoresistive RAM)
  • Memory Size:16Mbit
  • Memory Organization:2M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-VDFN Exposed Pad
  • Supplier Device Package:8-DFN (5x6)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for EM016LXQBDH13ES2R

EM016LXQBDH13ES2R

Memory IC Overview

The EM016LXQBDH13ES2R is a 16 Mbit Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a Quad SPI interface operating at clock frequencies up to 133 MHz and utilizes an 8-DFN package. The device supports a supply voltage range of 1.65 V to 2 V and offers a memory organization of 2 M x 8. It is designed for surface mount installation and operates within a temperature range of -40°C to +105°C.

Memory IC Feature Summary

  • Non-volatile data retention utilizing magnetoresistive technology
  • High-speed Quad Serial Peripheral Interface communication
  • Extended industrial temperature operation capability

Memory IC Applications

  • Industrial control systems requiring persistent storage
  • Automotive electronics with high thermal demands
  • Embedded systems needing fast boot-up times

Memory IC Procurement Notes

Verify the specific suffix 'S2' against official datasheets to confirm it denotes the commercial temperature grade variant, distinct from the 'S1' industrial grade. Ensure the reel packaging format matches production line requirements. Confirm RoHS compliance status through current manufacturer documentation before finalizing procurement orders.

Memory IC Selection Notes

Select this component when non-volatility and high endurance are required without the complexity of flash programming algorithms. The 16 Mbit capacity suits applications needing moderate storage density. Verify that the 8-DFN footprint fits the PCB layout constraints and that the 1.65 V to 2 V supply rail is available on the target system board.

Memory IC Part Context

This part belongs to the EMxxLX series of MRAM devices from Everspin Technologies. It shares core architectural similarities with other members like the EM016LXQBDH13IS1T but differs in temperature rating and packaging configuration. The series represents a transition toward higher density and improved performance in magnetoresistive memory solutions.

Memory IC Replacement Considerations

The suggested alternate part number is EM016LXQBDH13ES2T. This alternative provides identical electrical specifications but utilizes tray packaging instead of reel packaging. Verify mechanical compatibility and handling procedures differ due to the change in shipping container type.

EM016LXQBDH13ES2REM016LXQBDH13ES2R
$18.81
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