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EM016LXQBDH13IS1R is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 16MB XSPI/QUAD 8DFN. Review the specifications below when checking this part for your BOM.
Memory IC specifications for EM016LXQBDH13IS1R
- Description：IC RAM 16MB XSPI/QUAD 8DFN
- Series：EMxxLX
- Mfr：Everspin Technologies Inc.
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：RAM
- Technology：MRAM (Magnetoresistive RAM)
- Memory Size：16Mbit
- Memory Organization：2M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：133 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-VDFN Exposed Pad
- Supplier Device Package：8-DFN (5x6)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for EM016LXQBDH13IS1R
Memory IC Overview
The EM016LXQBDH13IS1R is a magnetoresistive random access memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a storage capacity of 16 Mbit organized as 2 M x 8. The device utilizes a Quad SPI interface with a clock frequency of 133 MHz. It operates within a supply voltage range of 1.65 V to 2 V and supports an industrial temperature range from -40°C to +85°C. The component is housed in an 8-DFN package.
Memory IC Feature Summary
- Non-volatile data retention utilizing spin-transfer torque MRAM technology
- Quad SPI interface for high-speed serial communication
- Industrial temperature rating for extended operational environments
Memory IC Applications
- Data logging systems requiring non-volatile storage
- Embedded controllers needing fast boot-up times
- Industrial equipment with harsh environmental requirements
Memory IC Procurement Notes
Verify the specific suffix 'S1' confirms the industrial temperature grade (-40°C to +85°C) against the manufacturer datasheet. Confirm the 8-DFN package dimensions match the target PCB footprint. Ensure the Quad SPI command set compatibility aligns with the host microcontroller firmware before finalizing procurement.
Memory IC Selection Notes
Select this part when non-volatility and high endurance are required without the latency of flash programming. The 16 Mbit density suits moderate storage needs. Compare against parallel MRAM options if higher bandwidth is necessary, or smaller densities like the 8 Mbit variant if cost reduction is prioritized over capacity.
Memory IC Part Context
This component belongs to the EMxxLX series of MRAM devices from Everspin Technologies. These devices are designed to replace traditional SRAM, Flash, and EEPROM solutions by offering unlimited write endurance and faster write speeds. The series emphasizes low power consumption and high reliability for embedded applications.
Memory IC Replacement Considerations
EM016LXQBDH13ES1R is listed as a suggested alternate part number.
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