EM02APYCL-AC000-2

Description：IC FLASH 16GBIT EMMC 153FBGA
Series：-
Mfr：Delkin Devices, Inc.
Package：Tray

SKU:8a5ea50e2e41 Category: Memory IC Brand: Delkin Devices, Inc.

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Product introduction

EM02APYCL-AC000-2 is listed in the Memory IC range at ChipApex. The manufacturer field lists Delkin Devices, Inc.. Its product description is IC FLASH 16GBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EM02APYCL-AC000-2

Description：IC FLASH 16GBIT EMMC 153FBGA
Series：-
Mfr：Delkin Devices, Inc.
Package：Tray
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NAND
Memory Size：16Gbit
Memory Organization：2G x 8
Memory Interface：eMMC
Clock Frequency：200 MHz
Write Cycle Time - Word, Page：-
Voltage - Supply：2.7V ~ 3.6V
Operating Temperature：-40°C ~ 85°C
Mounting Type：Surface Mount
Package / Case：153-VFBGA
Supplier Device Package：153-FBGA (11.5x13)
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for EM02APYCL-AC000-2

EM02APYCL-AC000-2

Memory IC Overview

The EM02APYCL-AC000-2 is an industrial-grade embedded Multi-Media Controller (eMMC) manufactured by Delkin Devices, Inc. It integrates flash memory and a controller on a single silicon die within a 153-ball package. The component complies with the eMMC 5.1 standard and supports operating temperatures from -40°C to 85°C. Available in 32GB and 64GB capacities, it features HS400 support, enhanced security, and rugged quality suitable for industrial platforms requiring controlled BOMs and extended lifecycles.

Memory IC Feature Summary

Integrates NAND flash memory and a dedicated controller on a single silicon die for simplified board design.
Compliant with eMMC 5.1 specification, supporting high-speed protocols including HS400.
Engineered for industrial durability with an extended operating temperature range of -40°C to 85°C.
Includes internal error correction code (ECC) and enhanced data management algorithms for reliable operation.

Memory IC Applications

Industrial platforms storing OS or application software
Data logging systems requiring rugged storage
Embedded devices needing extended product lifecycles

Memory IC Procurement Notes

Verify the specific capacity requirement, as the series includes both 32GB and 64GB options. Confirm the 153-ball package compatibility with the target PCB footprint. Ensure the design accounts for the specified industrial temperature range and voltage requirements. Cross-reference the exact suffix with official documentation to confirm feature sets like HS400 support.

Memory IC Selection Notes

Select this component for applications demanding high durability and long-term availability in harsh environments. The integrated controller simplifies design compared to discrete NAND solutions. Verify that the host interface supports the required bus widths and clock frequencies for optimal performance.

Memory IC Part Context

This part belongs to Delkin Devices' Industrial eMMC line, designed specifically for rugged applications. Unlike consumer-grade parts, these components prioritize longevity, thermal stability, and consistent performance under stress. The 153-ball form factor allows for direct soldering to main boards, reducing assembly complexity.