EM032LXQAB313ES2T

Memory IC Overview

The EM032LXQAB313ES2T is a Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a storage capacity of 32 Mbit organized as 4 M x 8 bits. The device utilizes a Quad SPI interface and operates at clock frequencies up to 133 MHz. It is housed in a 24-BGA package with surface mount installation style. The component supports a supply voltage range from 1.65 V to 2 V, with typical operating currents specified at 124 mA and 156 mA. The commercial temperature grade ensures reliable operation within a range of 0°C to +70°C.

Memory IC Feature Summary

• Non-volatile data retention without requiring power for data preservation
• High-speed serial communication via Quad SPI interface
• Robust construction suitable for industrial and embedded environments

Memory IC Applications

• Industrial control systems requiring persistent memory
• Embedded applications needing fast boot-up times
• Automotive electronics demanding high reliability

Memory IC Procurement Notes

Verify the specific suffix ES2T against official datasheets to confirm the commercial temperature grade and tray packaging format. Ensure compatibility with the target system's voltage levels and SPI protocol requirements before integration. Cross-reference the manufacturer part number with authorized distributors to avoid counterfeit components.

Memory IC Selection Notes

Select this model when a non-volatile solution with SRAM-like speed is required. Compare the 32 Mbit capacity against alternative densities if space or cost constraints exist. Verify that the 24-BGA footprint fits the PCB design and that the 1.65 V to 2 V supply rail matches the system architecture.

Memory IC Part Context

This component belongs to the Everspin MRAM family, which combines the endurance of flash with the speed of RAM. The EM032 series offers high write cycle endurance, making it suitable for frequent data logging applications. It represents a shift towards magnetoresistive technology for embedded storage needs.

Memory IC Replacement Considerations

Check for direct substitutes within the same density and package family, such as variants with different temperature grades or packaging options. Ensure any replacement maintains the Quad SPI interface and compatible voltage specifications.