Memory IC EM032LXQAB313IS1R product image

EM032LXQAB313IS1R

$22.92
  • Description:IC RAM 32MBIT XSPI/QUAD 24TBGA
  • Series:EMxxLX
  • Mfr:Everspin Technologies Inc.
  • Package:Tape & Reel (TR)

SKU:edb31d3709a9 Category: Brand:

  
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EM032LXQAB313IS1R is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 32MBIT XSPI/QUAD 24TBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EM032LXQAB313IS1R

  • Description:IC RAM 32MBIT XSPI/QUAD 24TBGA
  • Series:EMxxLX
  • Mfr:Everspin Technologies Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:RAM
  • Technology:MRAM (Magnetoresistive RAM)
  • Memory Size:32Mbit
  • Memory Organization:4M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TBGA (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for EM032LXQAB313IS1R

EM032LXQAB313IS1R

Memory IC Overview

The EM032LXQAB313IS1R is a 32 Mbit Magnetoresistive Random Access Memory (MRAM) device from the Everspin EMxxLX series. It features a Quad SPI interface operating at frequencies up to 133 MHz. The memory is organized as 4 M x 8 bits and housed in a 24-TBGA package measuring 6x8 mm. It operates within a supply voltage range of 1.65 V to 2 V, with typical active currents of 124 mA and 156 mA. The component supports surface mount installation and functions within an industrial temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Non-volatile data retention utilizing spin-transfer torque MRAM technology for unlimited endurance.
  • Quad SPI compatible interface enabling high-speed serial communication up to 133 MHz.
  • Low voltage operation optimized for power-constrained embedded systems.

Memory IC Applications

  • Industrial control systems requiring frequent data logging
  • Automotive electronics needing robust non-volatile storage
  • IoT devices with limited power budgets

Memory IC Procurement Notes

Verify the specific suffix IS1R against your bill of materials, as it denotes the reel packaging format. Confirm the 24-TBGA footprint dimensions match your PCB layout constraints. Ensure your system provides a stable 1.65V to 2V power rail capable of sourcing the specified peak current during write operations. Check RoHS compliance status if required by your manufacturing standards.

Memory IC Selection Notes

Select this part when high endurance and fast random access are critical compared to flash alternatives. The 32 Mbit density suits applications needing moderate storage capacity without complex wear-leveling algorithms. Consider the TBGA package size relative to available board space. Verify that the host controller supports the required Quad SPI protocol for optimal performance.

Memory IC Part Context

This component belongs to the Everspin EMxxLX series, which focuses on low-power, high-performance MRAM solutions. The series integrates standard SPI compatibility with the durability of magnetic memory technology. It serves as a drop-in replacement for many serial flash applications where write speed and endurance are limiting factors.

Memory IC Replacement Considerations

Direct substitutes may include other 32 Mbit Quad SPI MRAM parts from Everspin, such as the EM032LXQBB313IS1R, though package or temperature variations should be verified. Cross-brand replacements require careful evaluation of pinout compatibility and timing parameters.

EM032LXQAB313IS1REM032LXQAB313IS1R
$22.92
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