EM032LXQADG13CS2T

Memory IC Overview

The EM032LXQADG13CS2T is a Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a storage capacity of 32 Mbit organized as 4 M x 8 bits. The device utilizes a Quad SPI interface operating at frequencies up to 133 MHz. It functions within a supply voltage range of 1.65 V to 2 V and supports surface mount installation in an 8-DFN package. The component operates reliably between 0°C and +70°C, with specified working power currents of 124 mA and 156 mA.

Memory IC Feature Summary

• Non-volatile memory technology retaining data without power
• Quad SPI interface for high-speed serial communication
• Low voltage operation compatible with 1.65V to 2V systems

Memory IC Applications

• Industrial control systems requiring persistent configuration storage
• Automotive electronics needing reliable non-volatile data retention
• Consumer devices utilizing MRAM for firmware storage

Memory IC Procurement Notes

Verify the specific suffix 'T' indicates tape and reel packaging when sourcing. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure the 8-DFN footprint matches the target PCB layout constraints. Validate that the operating temperature range meets the environmental requirements of the final assembly.

Memory IC Selection Notes

Select this component for applications requiring non-volatile storage with high endurance and low power consumption. Compare against other capacities in the EMxxLX series if different memory sizes are needed. Ensure the Quad SPI interface compatibility aligns with the host controller's peripheral capabilities. Verify package availability and lead times for production planning.

Memory IC Part Context

This part belongs to the EMxxLX family of MRAM devices from Everspin Technologies. These devices offer high-performance multiple I/O and SPI-compatible interfaces. The family is characterized by 1.65V to 2V voltage operation and robust data retention capabilities suitable for demanding electronic environments.

Memory IC Replacement Considerations

Check for direct substitutes within the same EMxxLX family with different capacities or packaging options. Verify pin-to-pin compatibility before replacing with other DFN-8 MRAM components.