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EM032LXQADG13ES1T is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 32MBIT XSPI 8DFN. Review the specifications below when checking this part for your BOM.
Memory IC specifications for EM032LXQADG13ES1T
- Description：IC RAM 32MBIT XSPI 8DFN
- Series：EMxxLX
- Mfr：Everspin Technologies Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：RAM
- Technology：MRAM (Magnetoresistive RAM)
- Memory Size：32Mbit
- Memory Organization：4M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-VDFN Exposed Pad
- Supplier Device Package：8-DFN (6x8)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for EM032LXQADG13ES1T
Memory IC Overview
The EM032LXQADG13ES1T is a magnetoresistive random access memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a storage capacity of 32 Mbit organized as 4 M x 8 bits. The device utilizes an Octal SPI interface with a clock frequency of 200 MHz. It operates within a supply voltage range of 1.65 V to 2 V and supports industrial temperature ranges from -40°C to +105°C. The component is housed in a 24-BGA package suitable for surface mount technology.
Memory IC Feature Summary
- Non-volatile data retention utilizing magnetic tunnel junction technology
- High-speed Octal SPI interface supporting up to 200 MHz operation
- Unlimited write endurance characteristics inherent to MRAM architecture
Memory IC Applications
- Industrial control systems requiring high endurance
- Automotive electronics operating in extreme temperatures
- IoT devices needing fast boot-up times
Memory IC Procurement Notes
Verify the specific suffix 'ES1T' against official datasheets to confirm package type and temperature grade. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly. Ensure compatibility with Octal SPI controllers. Check for RoHS compliance status. Validate lead times due to potential manufacturing delays.
Memory IC Selection Notes
Select this component when Octal SPI speed is required over Quad SPI variants. Compare against EM032LXOAB320ES1T for pinout and feature differences. Consider the 24-BGA footprint constraints during PCB layout. Evaluate power consumption requirements at 200 MHz versus lower speed options.
Memory IC Part Context
This part belongs to the EMxxLX series of MRAM devices from Everspin Technologies. These devices are designed to replace traditional flash and EEPROM technologies in applications demanding high reliability and speed. The series offers various capacities and interface options including Quad and Octal SPI.
Memory IC Replacement Considerations
EM032LXOAB320ES1T is listed as a suggested alternate. Verify electrical and mechanical compatibility before substitution.
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