Memory IC EM032LXQADG13ES2R product image

EM032LXQADG13ES2R

$27.26
  • Description:IC RAM 32MBIT XSPI 8DFN
  • Series:EMxxLX
  • Mfr:Everspin Technologies Inc.
  • Package:Tape & Reel (TR)

SKU:b87de372f18f Category: Brand:

  
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EM032LXQADG13ES2R is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 32MBIT XSPI 8DFN. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EM032LXQADG13ES2R

  • Description:IC RAM 32MBIT XSPI 8DFN
  • Series:EMxxLX
  • Mfr:Everspin Technologies Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:RAM
  • Technology:MRAM (Magnetoresistive RAM)
  • Memory Size:32Mbit
  • Memory Organization:4M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-VDFN Exposed Pad
  • Supplier Device Package:8-DFN (6x8)
  • Access Time:7 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for EM032LXQADG13ES2R

EM032LXQADG13ES2R

Memory IC Overview

The EM032LXQADG13ES2R is a 32 Mbit Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a Quad SPI interface operating at frequencies up to 133 MHz. The device is organized as 4 M x 8 bits and operates within a supply voltage range of 1.65 V to 2 V. It is housed in an 8-DFN package with dimensions of 6x8 mm, designed for surface mount technology (SMD/SMT). The component supports industrial temperature ranges from -40°C to +105°C and includes humidity sensitivity characteristics.

Memory IC Feature Summary

  • Non-volatile memory architecture retaining data without power
  • Quad Serial Peripheral Interface (SPI) for high-speed data transfer
  • Spin-transfer torque magnetoresistive random access memory technology
  • Industrial grade operational temperature capability

Memory IC Applications

  • Embedded systems requiring non-volatile storage
  • Industrial control applications
  • Automotive electronics
  • Transportation systems

Memory IC Procurement Notes

Verify the specific suffix 'R' indicates reel packaging when sourcing. Confirm the extended industrial temperature range (-40°C to +105°C) matches your environmental requirements. Ensure the 8-DFN footprint aligns with your PCB design constraints. Cross-reference the datasheet for exact pinout and electrical specifications before integration.

Memory IC Selection Notes

Select this model for applications demanding high endurance and non-volatility with SPI compatibility. Compare against the EM032LXQADG13ES1T if tape-and-reel versus tray packaging is required. Consider the EM032LXOAB320ES2T for higher speed octal interfaces or different form factors. Verify voltage levels strictly adhere to the 1.65V to 2V specification.

Memory IC Part Context

This component belongs to the Everspin EMxxLX series of MRAM devices. These devices utilize spin-transfer torque technology to provide SRAM-like performance with non-volatile persistence. The series is designed for embedded applications in industrial, automotive, and enterprise markets, offering unlimited write endurance compared to traditional flash memory technologies.

Memory IC Replacement Considerations

The EM032LXQADG13ES1T is a suggested alternate part number from the manufacturer. Verify if the packaging difference (reel vs. tray) is the only distinction. No other direct substitutes are publicly confirmed in the provided documentation.

EM032LXQADG13ES2REM032LXQADG13ES2R
$27.26
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