EM032LXQADG13IS1R

Memory IC Overview

The EM032LXQADG13IS1R is a 32 Mbit Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a Quad SPI interface operating at frequencies up to 133 MHz and is organized as 4 M x 8 bits. The device operates within a supply voltage range of 1.65 V to 2 V, with typical working power currents of 124 mA and 156 mA. It is housed in an 8-DFN package and supports surface mount installation. The component is rated for industrial temperature ranges from -40°C to +105°C.

Memory IC Feature Summary

• Provides non-volatile data retention without requiring write delays or charge pumping mechanisms.
• Offers unlimited endurance capabilities suitable for frequent write-intensive operations.
• Integrates high-speed Quad SPI interface for efficient serial data communication.
• Delivers performance characteristics comparable to standard SRAM while maintaining persistent storage.

Memory IC Applications

• IoT devices requiring fast non-volatile memory
• Automotive systems needing reliable embedded storage
• Industrial controllers demanding high endurance
• Embedded applications requiring persistent configuration data

Memory IC Procurement Notes

Verify the specific suffix 'IS1R' confirms the industrial temperature grade (-40°C to +105°C) and tape-and-reel packaging format. Ensure compatibility with 1.65V to 2V supply rails. Confirm the 8-DFN footprint dimensions match the PCB layout. Validate that the Quad SPI protocol aligns with the host controller's interface capabilities before finalizing procurement.

Memory IC Selection Notes

Select this part when application requirements demand infinite write endurance and non-volatility without the complexity of flash programming algorithms. The 32 Mbit capacity and 133 MHz speed suit high-throughput embedded systems. Compare against parallel MRAM options if bus width constraints differ. Ensure the system voltage strictly adheres to the 1.65V–2V specification to prevent operational failure.

Memory IC Part Context

This component belongs to the EMxxLX series of Spin-Transfer Torque MRAM devices from Everspin Technologies. These devices utilize advanced MTJ technology to combine the speed of RAM with the persistence of non-volatile memory. The series is designed for applications replacing traditional EEPROM, Flash, and SRAM with battery backup, offering superior reliability and lower power consumption in compact packages.

Memory IC Replacement Considerations

The EM032LXQADG13ES2T is listed as a suggested alternate part number. Verify if the 'ES' suffix indicates a different temperature grade or packaging variant compared to the 'IS' version. Ensure pinout and electrical specifications remain identical to avoid redesign efforts during substitution.