EM032LXQADG13IS2R

Memory IC Overview

The EM032LXQADG13IS2R is a Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a storage capacity of 32 Mbit organized as 4 M x 8 bits. The device utilizes a Quad SPI interface operating at frequencies up to 133 MHz. It is housed in an 8-DFN surface-mount package. Electrical specifications include a minimum supply voltage of 1.65 V and a maximum of 2 V. Operating currents are specified at 124 mA and 156 mA under different conditions. The component supports industrial temperature ranges from -40°C to +85°C.

Memory IC Feature Summary

• Non-volatile data retention without power
• Quad SPI interface for high-speed communication
• Industrial temperature range support

Memory IC Applications

• Industrial control systems requiring persistent memory
• Automotive embedded applications
• Data logging devices

Memory IC Procurement Notes

Verify the specific suffix 'IS2R' against official Everspin documentation to confirm the exact temperature grade and packaging configuration. Ensure compatibility with system voltage rails between 1.65 V and 2 V. Confirm that the 8-DFN footprint matches the PCB design constraints. Check for any recent product change notices regarding lead times or material composition updates.

Memory IC Selection Notes

Select this component when non-volatility, high endurance, and fast read speeds are required in a small form factor. Compare against parallel MRAM options if higher bandwidth is needed, or against serial EEPROMs if lower cost is prioritized over speed. Verify that the 32 Mbit capacity meets the application's storage requirements without excessive overhead.

Memory IC Part Context

This part belongs to the EMxxLX series of Quad SPI MRAM devices from Everspin Technologies. These devices are designed to replace traditional flash and EEPROM technologies in applications demanding high write endurance and low power consumption. The series offers a drop-in compatible solution for many embedded memory architectures.

Memory IC Replacement Considerations

Check for EM032LXQADG13CS2R for commercial temperature variants. Verify EM032LXQADG13IS2T for tape and reel packaging differences if available.