EM064LXQAB313ES1R

Memory IC Overview

The EM064LXQAB313ES1R is a Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a storage capacity of 64 Mbit organized as 8M x 8 bits. The device utilizes a Quad SPI interface and operates at frequencies up to 133 MHz. It is housed in a 24-BGA package designed for surface mount technology. The component supports a supply voltage range from 1.65 V to 2 V. Operating temperatures extend from -40°C to +105°C, indicating industrial-grade suitability.

Memory IC Feature Summary

• Non-volatile magnetic memory technology providing persistent data retention without power
• Quad Serial Peripheral Interface enabling high-speed data transfer operations
• Industrial temperature range support for demanding environmental conditions

Memory IC Applications

• Embedded systems requiring persistent high-speed memory
• Data center infrastructure components
• Mission-critical industrial applications

Memory IC Procurement Notes

Verify the specific suffix ES1R against official documentation to confirm reel packaging and exact electrical characteristics. Ensure compatibility with the required 1.65V to 2V supply rails. Confirm that the 24-BGA footprint matches the target PCB design. Validate that the operating temperature range meets the application's thermal requirements before finalizing procurement.

Memory IC Selection Notes

Select this component when non-volatility combined with high endurance is critical. The 64 Mbit capacity suits moderate storage needs. The Quad SPI interface offers speed advantages over standard SPI variants. Consider the 24-BGA package constraints for layout. Verify that the industrial temperature rating aligns with the operational environment specifications.

Memory IC Part Context

This part belongs to the EMxxLX series of MRAM products from Everspin Technologies. It shares architectural similarities with other members like the EM004LX and EM016LX but differs in density. The series targets embedded applications needing fast, durable, and persistent memory solutions. It represents a standalone memory solution distinct from embedded MRAM implementations.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material.