Memory IC EM064LXQAB313ES1T product image

EM064LXQAB313ES1T

$39.40
  • Description:IC RAM 64MBIT XSPI 24TBGA
  • Series:EMxxLX
  • Mfr:Everspin Technologies Inc.
  • Package:Tray

SKU:79b403d20ccb Category: Brand:

  
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EM064LXQAB313ES1T is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 64MBIT XSPI 24TBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EM064LXQAB313ES1T

  • Description:IC RAM 64MBIT XSPI 24TBGA
  • Series:EMxxLX
  • Mfr:Everspin Technologies Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:RAM
  • Technology:MRAM (Magnetoresistive RAM)
  • Memory Size:64Mbit
  • Memory Organization:8M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TBGA (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for EM064LXQAB313ES1T

EM064LXQAB313ES1T

Memory IC Overview

The EM064LXQAB313ES1T is a magnetoresistive random-access memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a storage capacity of 64 Mbit organized as 8 M x 8 bits. The device utilizes an Octal SPI interface operating at frequencies up to 200 MHz and is housed in a 24-BGA package. It supports a supply voltage range from 1.65 V to 2 V, with typical operating currents specified at 124 mA and 156 mA. The component is rated for an industrial temperature range spanning from -40°C to +105°C.

Memory IC Feature Summary

  • Non-volatile magnetic storage technology providing instant-on capability without initialization delays.
  • High-speed Octal SPI interface enabling efficient data transfer rates up to 200 MHz.
  • Robust endurance characteristics suitable for applications requiring frequent write cycles.

Memory IC Applications

  • Industrial control systems requiring reliable non-volatile data retention
  • Automotive electronics operating within extended temperature environments
  • Embedded systems needing high-speed configuration storage

Memory IC Procurement Notes

Verify the exact suffix against official manufacturer documentation to confirm interface speed and temperature grade specifications. Ensure compatibility with the target system's power supply voltage limits and thermal management requirements before integration. Confirm moisture sensitivity level handling procedures during assembly to prevent package damage.

Memory IC Selection Notes

Select this component when high-density non-volatile storage is required alongside fast read/write performance. Compare against lower-capacity variants if system constraints allow reduced memory footprint. Consider the BGA package profile for PCB layout constraints and ensure adequate thermal dissipation paths are designed into the board architecture.

Memory IC Part Context

This part belongs to the EMxxLX series of MRAM devices from Everspin Technologies. It represents a higher-capacity option within the family, offering 64 Mbit density compared to smaller variants like the 8 Mbit or 16 Mbit models. The series shares common interface protocols but varies in organization and maximum clock speeds based on specific suffix designations.

Memory IC Replacement Considerations

Publicly documented suggested alternate part numbers include EM064LXOAB320ES2T. Verify pinout compatibility and electrical specifications before substitution.

EM064LXQAB313ES1TEM064LXQAB313ES1T
$39.40
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