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EM08APGD3-BA000-2 is listed in the Memory IC range at ChipApex. The manufacturer field lists Delkin Devices, Inc.. Its product description is IC FLASH 64GBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for EM08APGD3-BA000-2
- Description：IC FLASH 64GBIT EMMC 153FBGA
- Series：G530
- Mfr：Delkin Devices, Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (MLC)
- Memory Size：64Gbit
- Memory Organization：8G x 8
- Memory Interface：eMMC
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-VFBGA
- Supplier Device Package：153-FBGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for EM08APGD3-BA000-2
Memory IC Overview
The EM08APGD3-BA000-2 is a 2GB embedded MultiMediaCard (eMMC) from the G530 Series, utilizing pSLC NAND technology. It features a 153-ball FBGA package with dimensions of 11.5x13x1.0 mm. The component supports eMMC specifications and is designed for industrial applications requiring controlled bill of materials and managed lifecycle support.
Memory IC Feature Summary
- Utilizes pSLC NAND flash memory technology for enhanced endurance and data retention compared to standard TLC options.
- Manufactured under a controlled Bill of Materials (BOM) process to ensure consistency across production runs.
- Includes managed lifecycle support to assist in long-term product planning and supply chain stability.
Memory IC Applications
- Industrial embedded systems requiring reliable non-volatile storage
- IoT devices with strict longevity requirements
- Automotive infotainment or control modules
Memory IC Procurement Notes
Verify current availability status as the G530 Series has received End-of-Life notifications for certain capacities. Confirm that the specific 2GB pSLC variant remains active for procurement before finalizing orders. Ensure compatibility with existing PCB footprints and controller interfaces.
Memory IC Selection Notes
Select this component when 2GB capacity is sufficient and pSLC reliability is prioritized over higher density options. Compare against other G530 variants if larger storage is needed. Ensure the 153-ball FBGA package fits the target design constraints.
Memory IC Part Context
This part belongs to the Delkin Devices G530 Series of industrial eMMC components. The series is characterized by its focus on durability and supply chain management for industrial OEMs. Other parts in the series vary in capacity and NAND type, such as the EM64FSTWH-BA000-2 which offers higher capacity using TLC technology.
Memory IC Replacement Considerations
Check for direct substitutes within the G530 series with different capacities. Verify if newer generations from Delkin or alternative manufacturers offer pin-compatible upgrades with improved performance metrics.
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