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EM128LXQAB313IS1R is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 128MBIT XSPI/QUAD 24TBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for EM128LXQAB313IS1R
- Description：IC RAM 128MBIT XSPI/QUAD 24TBGA
- Series：EMxxLX
- Mfr：Everspin Technologies Inc.
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：RAM
- Technology：MRAM (Magnetoresistive RAM)
- Memory Size：128Mbit
- Memory Organization：16M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：133 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.7V ~ 2V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：24-TBGA
- Supplier Device Package：24-TBGA (6x8)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for EM128LXQAB313IS1R
Memory IC Overview
The EM128LXQAB313IS1R is an 8 Mbit Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a Quad SPI interface operating at frequencies up to 133 MHz and utilizes a 1 M x 8 organization. The device operates within a supply voltage range of 1.65 V to 2 V, with specified working power currents of 124 mA and 156 mA. It is housed in a BGA-24 package designed for surface mount technology (SMD/SMT). The component supports an industrial temperature range from -40°C to +85°C and belongs to the EMxxLX series.
Memory IC Feature Summary
- Non-volatile data retention utilizing magnetoresistive random access memory technology
- High-speed Quad Serial Peripheral Interface (SPI) communication capability
- Low voltage operation optimized for energy-efficient embedded systems
Memory IC Applications
- Industrial control system data logging
- Automotive sensor data storage
- Consumer electronics firmware backup
Memory IC Procurement Notes
Verify the specific suffix codes against official manufacturer documentation to confirm exact electrical characteristics and packaging specifications. Ensure compatibility with the target system's voltage levels and interface requirements before integration. Confirm availability status directly with authorized distributors as supply conditions may vary.
Memory IC Selection Notes
Select this component when non-volatile storage with high endurance and fast write speeds is required in space-constrained designs. The BGA-24 package suits applications needing compact footprints. Verify that the 1.65 V to 2 V operating range aligns with the system power architecture and that the industrial temperature rating meets environmental demands.
Memory IC Part Context
This part belongs to the EMxxLX series of MRAM devices from Everspin Technologies. These components are characterized by high performance, multiple I/O options, and SPI compatibility. They are designed to replace traditional flash memory solutions in applications requiring faster write cycles and higher durability.
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