Memory IC EM64VSUKN-BA000-2 product image

EM64VSUKN-BA000-2

$19.54
  • Description:IC FLASH 512GBIT EMMC 153FBGA
  • Series:-
  • Mfr:Delkin Devices, Inc.
  • Package:Tray

SKU:2a12c6a9015c Category: Brand:

  
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EM64VSUKN-BA000-2 is listed in the Memory IC range at ChipApex. The manufacturer field lists Delkin Devices, Inc.. Its product description is IC FLASH 512GBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EM64VSUKN-BA000-2

  • Description:IC FLASH 512GBIT EMMC 153FBGA
  • Series:-
  • Mfr:Delkin Devices, Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND
  • Memory Size:512Gbit
  • Memory Organization:64G x 8
  • Memory Interface:eMMC
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:3.3V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:153-VFBGA
  • Supplier Device Package:153-FBGA (11.5x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for EM64VSUKN-BA000-2

EM64VSUKN-BA000-2

Memory IC Overview

The EM64VSUKN-BA000-2 is a NAND Flash memory IC manufactured by Delkin Devices, Inc. It features a storage capacity of 512 Gbit and utilizes the eMMC interface standard. The device operates at a clock frequency of 200 MHz and is housed in a 153-ball FBGA package with dimensions of 11.5x13 mm. It supports an extended industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Built-in wear leveling function for enhanced longevity
  • Integrated bad block management capabilities
  • Hardware ECC error correction support

Memory IC Applications

  • Industrial embedded systems requiring wide temperature tolerance
  • Consumer electronics utilizing eMMC storage interfaces
  • Portable devices needing high-density NAND flash solutions

Memory IC Procurement Notes

Verify the specific manufacturer datasheet for electrical characteristics and mechanical drawings before integration. Confirm that the 153-FBGA footprint matches your PCB design constraints. Ensure compatibility with the host controller's eMMC protocol version and voltage requirements. Check for any specific ordering suffixes that may indicate different packaging or quality grades.

Memory IC Selection Notes

Select this component when a 512 Gbit density is required within a compact 153-ball FBGA form factor. The industrial temperature rating makes it suitable for harsh environments where standard commercial parts would fail. Consider the built-in wear leveling and ECC features if system-level reliability is critical without additional external controllers.

Memory IC Part Context

This part belongs to Delkin Devices' NAND memory portfolio, specifically designed for embedded multimedia card applications. It serves as a direct replacement for other 512 Gbit eMMC components in the same package type. The product line emphasizes durability through internal management functions like bad block handling.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify pin-to-pin compatibility and functional equivalence with alternative vendors before substitution.

EM64VSUKN-BA000-2EM64VSUKN-BA000-2
$19.54
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