Memory IC EM68B16CWQK-25IH product image

EM68B16CWQK-25IH

$2.52
  • Description:IC DRAM 512MBIT PARALLEL 84FBGA
  • Series:-
  • Mfr:Etron Technology, Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:1371fd300201 Category: Brand:

  
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EM68B16CWQK-25IH is listed in the Memory IC range at ChipApex. The manufacturer field lists Etron Technology, Inc.. Its product description is IC DRAM 512MBIT PARALLEL 84FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EM68B16CWQK-25IH

  • Description:IC DRAM 512MBIT PARALLEL 84FBGA
  • Series:-
  • Mfr:Etron Technology, Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR2
  • Memory Size:512Mbit
  • Memory Organization:32M x 16
  • Memory Interface:Parallel
  • Clock Frequency:400 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:84-TFBGA
  • Supplier Device Package:84-FBGA (8x12.5)
  • Access Time:400 ps
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for EM68B16CWQK-25IH

EM68B16CWQK-25IH

Memory IC Overview

The EM68B16CWQK-25IH is a 32M x 16 bit DDR2 SDRAM manufactured by Etron Technology, Inc. It operates at a clock frequency of 400MHz with a data rate of 800Mbps/pin. The device utilizes a quad-bank architecture (4 banks x 8Mb addresses x 16 I/Os) and requires VDD and VDDQ power supplies of +1.8V ±0.1V. It supports CAS Latency 5, tRCD of 12.5ns, and tRP of 12.5ns. The component is housed in an 84-ball FBGA package measuring 8x12.5x1.2mm maximum dimensions and is rated for industrial operating temperatures ranging from -40°C to +95°C.

Memory IC Feature Summary

  • Supports differential clock inputs and bidirectional single or differential data strobes for precise timing synchronization.
  • Features programmable On-Die Termination (ODT) and Off-Chip Driver (OCD) impedance adjustment capabilities.
  • Includes internal pipeline architecture with four independent memory banks for concurrent operations.
  • Provides auto-refresh and self-refresh modes with temperature-dependent refresh period configurations.

Memory IC Applications

  • Industrial control systems requiring stable memory performance across wide temperature ranges
  • Automotive electronic modules designed for harsh environmental conditions
  • Embedded computing platforms utilizing DDR2 SDRAM interfaces

Memory IC Procurement Notes

Verify the specific speed grade suffix matches the required system clock frequency. Confirm that the ordering code includes the correct package designation and temperature rating. Ensure compatibility with the host controller's voltage levels and termination requirements before finalizing procurement orders.

Memory IC Selection Notes

Select this part when a 32M x 16 configuration is required within an industrial temperature range up to 95°C. Consider the 400MHz clock speed and associated timing parameters against the system bus requirements. Evaluate the need for OCD calibration features and ODT settings during the hardware design phase.

Memory IC Part Context

This component belongs to the EM68B16C series of DDR2 synchronous dynamic random-access memories. The series offers various speed grades and packaging options to accommodate different bandwidth and form factor constraints in embedded and industrial applications.

Memory IC Replacement Considerations

Compatible parts include the EM68B16CWQK-18IH and EM68B16CWQK-3IH from the same manufacturer family. Verify pinout and electrical specifications match before substituting.

Memory IC FAQ

What are the supported additive latency values?

The device supports posted CAS# additive latencies of 0, 1, 2, 3, 4, and 5 cycles.

How does the device handle high-temperature refresh rates?

At temperatures between +85°C and +95°C, the average refresh period is 32ms (3.9us), whereas it is 64ms (7.8us) between -40°C and +85°C.

EM68B16CWQK-25IHEM68B16CWQK-25IH
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