EM68D16CBQC-18H

Memory IC Overview

The EM68D16CBQC-18H is a 2Gb DDR2 SDRAM component designed for automotive applications. It features a density of 2Gb organized as 128M x 16 and utilizes an 84-ball FBGA package compatible with JEDEC standards. The device operates at a typical voltage of 1.8V and supports internal on-die termination (ODT) to reduce signal reflection. It offers Grade 3 temperature coverage from -40°C to 85°C and Grade 2 coverage extending to 105°C. The chip has passed AEC-Q100 stress testing, including ELFR, HTOL, and MSL certifications.

Memory IC Feature Summary

• Automotive-grade reliability certified by AEC-Q100 stress tests
• DDR2 architecture with internal on-die termination for signal integrity
• Low power consumption compared to first-generation DDR
• JEDEC standard pin compatibility for hardware upgrades

Memory IC Applications

• In-vehicle infotainment systems
• Digital instrument clusters
• ADAS front-facing cameras
• Automotive hard disk and DVD buffering

Memory IC Procurement Notes

Verify the specific temperature grade required for your application, as the part number suffix may indicate either Grade 3 (-40°C to 85°C) or Grade 2 (-40°C to 105°C). Confirm that the 84-ball FBGA package aligns with your PCB layout constraints. Ensure the design accounts for the 1.8V operating voltage and DDR2 interface timing requirements. Validate that the supplier provides documentation confirming AEC-Q100 compliance for the specific batch.

Memory IC Selection Notes

Select this component when high bandwidth and low power are critical for automotive storage needs. The DDR2 architecture provides higher data throughput than DDR at the same core frequency. Consider the 128M x 16 organization for applications requiring wide data buses. The choice between temperature grades depends on whether the installation environment exceeds 85°C. The small form factor aids in space-constrained designs like multi-camera setups.

Memory IC Part Context

This DRAM chip addresses the increasing memory demands of connected and autonomous vehicles. It serves as a high-reliability solution for processing large data streams from sensors and displays. The design focuses on stability under thermal stress and vibration, which are common in automotive environments. It complements other system components by providing fast, temporary data storage for real-time operations.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.